Features: 1.8 V to 5.5 V operation Ultralow on resistance 0.4 typical 0.6 maximum at 5 V supply Excellent audio performance, ultralow distortion 0.07 typical 0.14 maximum RON flatness High current carrying capability 400 mA continuous 600 mA peak current at 5 V Automotive temperature ran...
ADG888: Features: 1.8 V to 5.5 V operation Ultralow on resistance 0.4 typical 0.6 maximum at 5 V supply Excellent audio performance, ultralow distortion 0.07 typical 0.14 maximum RON flatness High c...
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| Parameter | Rating |
| VDD to GND Analog Inputs1, Digital Inputs1 Peak Current, S or D Continuous Current, S or D Operating Temperature Range Automotive (Y Version) Storage Temperature Range Junction Temperature 16-Lead TSSOP Package JA Thermal Impedance (4-Layer Board) JC Thermal Impedance 16-Lead WLCSP Package JA Thermal Impedance (4-Layer Board) 16-Lead LFCSP Package JA Thermal Impedance (4-Layer Board) IR Reflow, Peak Temperature <20 sec |
−0.3 V to +6 V −0.3 V to VDD + 0.3 V or 10 mA, whichever occurs first 600 mA (pulsed at 1 ms, 10% duty cycle max) 400 mA −40°C to +125°C −65°C to +150°C 150°C 112°C/W 27.6°C/W 130°C/W 30.4°C/W 235°C |
The ADG888 is a low voltage, dual DPDT (double pole double throw) CMOS device optimized for high performance audio switching. With its low power and small physical size, it is ideal for portable devices.
This device offers ultralow on resistance of less than 0.8 over the full temperature range making it an ideal solution for applications requiring minimal distortion through the switch. The ADG888 also has the capability of carrying large amounts of current, typically 400 mA at 5 V operation.
When on, each switch conducts equally well in both directions and has an input signal range that extends to the supplies. The ADG888 exhibits break-before-make switching action.
The ADG888 is available in a 4 * 4 bump, 2.0 mm * 2.0 mm WLCSP; a 4 mm * 4 mm, 16-lead LFCSP; and a 16-lead TSSOP. These packages make the ADG888 the ideal solution for space-constrained applications.