Features: .REFRACTORY/GOLD METALLIZATION.EMITTER SITE BALLASTED.LOW THERMAL RESISTANCE.INPUT/OUTPUT MATCHING.OVERLAYGEOMETRY.METAL/CERAMIC HERMETIC PACKAGE.POUT=125WMIN.WITH7.0dBGAINPinoutSpecifications Symbol Parameter Value Unit PDISS Power Dissipation* (TC 3 75°C) 500 W IC...
AM2729-125: Features: .REFRACTORY/GOLD METALLIZATION.EMITTER SITE BALLASTED.LOW THERMAL RESISTANCE.INPUT/OUTPUT MATCHING.OVERLAYGEOMETRY.METAL/CERAMIC HERMETIC PACKAGE.POUT=125WMIN.WITH7.0dBGAINPinoutSpecificat...
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Features: . REFRACTORY/G . OLD METALLIZATION . EMITTER SITE BALLASTED . 3:1 VSWR CAPABILITY·LOW TH...

| Symbol | Parameter | Value | Unit |
| PDISS | Power Dissipation* (TC 3 75°C) | 500 | W |
| IC | Device Current* | 16 | A |
| VCC | Collector-Supply Voltage* | 45 | V |
| TJ | Junction Temperature (Pulsed RF Operation) | 250 | °C |
| TSTG | Storage Temperature | - 65 to +200 | °C |