HEATSINK FORGED W/ADHESIVE TAPE
APF30-30-10CB/A01: HEATSINK FORGED W/ADHESIVE TAPE
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Capacitance : | 16.5 pF | Series: | APF |
Manufacturer: | CTS Thermal Management Products | Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) | Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square | Length: | 1.181" (30.00mm) |
Width: | 1.181" (30.00mm) | Diameter: | - |
Height Off Base (Height of Fin): | 0.370" (9.40mm) | Power Dissipation @ Temperature Rise: | - |
Thermal Resistance @ Forced Air Flow: | 3.3°C/W @ 200 LFM | Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Technical/Catalog Information | APF30-30-10CB/A01 |
Vendor | CTS Thermal Management Products |
Category | Fans, Thermal Management |
Attachment Method | Thermal Tape, Adhesive (Included) |
Height | 0.37" (9.40mm) |
Material | Aluminum |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | 3.3°C/W @ 200 LFM |
Outline | 30.00mm x 30.00mm |
Thermal Resistance @ Natural | - |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | APF30 30 10CB A01 APF303010CBA01 294 1154 ND 2941154ND 294-1154 |