APM2014N U

Features: · 20V/40A,RDS(ON)=12mW (typ.) @ VGS=4.5VRDS(ON)=18mW (typ.) @ VGS=2.5V· Super High Dense Cell Design· Reliable and Rugged· Lead Free Available (RoHS Compliant)ApplicationPower Management in Desktop Computer or DC/DC ConvertersSpecifications Symbol Parameter Rating Unit Common ...

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APM2014N U Picture
SeekIC No. : 004286739 Detail

APM2014N U: Features: · 20V/40A,RDS(ON)=12mW (typ.) @ VGS=4.5VRDS(ON)=18mW (typ.) @ VGS=2.5V· Super High Dense Cell Design· Reliable and Rugged· Lead Free Available (RoHS Compliant)ApplicationPower Management i...

floor Price/Ceiling Price

Part Number:
APM2014N U
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/5/3

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Product Details

Description



Features:

· 20V/40A,
RDS(ON)=12mW (typ.) @ VGS=4.5V
RDS(ON)=18mW (typ.) @ VGS=2.5V
· Super High Dense Cell Design
· Reliable and Rugged
· Lead Free Available (RoHS Compliant)




Application

Power Management in Desktop Computer or DC/DC Converters


Specifications

Symbol Parameter Rating Unit
Common Ratings (TA=25°C Unless Otherwise Noted)
VDSS Drain-Source Voltage 20 V
VGSS Gate-Source Voltage ±16
TJ Maximum Junction Temperature 150 °C
TSTG Storage Temperature Range -55 to 150 °C
IS Diode Continuous Forward Current TC=25°C 16 A
Mounted on Large Heat Sink
IDP 300s Pulse Drain Current Tested TC=25°C 100 A
TC=100°C 75
ID Continuous Drain Current TC=25°C 40* A
TC=100°C 25
PD Maximum Power Dissipation TC=25°C 50 W
TC=100°C 20
RJC Thermal Resistance-Junction to Case 2.5 °C/W
Mounted on PCB of 1in2 pad area
IDP 300s Pulse Drain Current Tested TA=25°C 100 A
TA=100°C 75
ID Continuous Drain Current TA=25°C 10 A
TA=100°C 6
PD Maximum Power Dissipation TA=25°C 2.5 W
TA=100°C 1
RJC Thermal Resistance-Junction to Ambient 50 °C/W
Mounted on PCB of Minimum Footprint
IDP 300s Pulse Drain Current Tested TA=25°C 100 A
TA=100°C 75
ID Continuous Drain Current TA=25°C 9 A
TA=100°C 6
PD Maximum Power Dissipation TA=25°C 1.6 W
TA=100°C 0.6
RJC Thermal Resistance-Junction to Ambient 75 °C/W


Note:
* Current limited by bond wire.




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