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Part Number: AS8202
Description: The AS8202 communications controller is an integrated device supporting serial communication according...


Description: The AS8202 communications controller is an integrated device supporting serial communication according...
The AS8202 communications controller is an integrated device supporting serial communication according to the TTP/C specification. It performs all communications tasks such as reception and transmission of messages in a TTP® cluster without interaction of the host CPU.
TTP® provides mechanisms that allow the deployment in high-dependability distributed real-time systems. It provides following services:
predictable transmission of messages with minimal jitter
fault-tolerant distributed clock synchronisation
consistent membership service with small delay
masking of single faults
The CNI (communication network interface) forms a temporal firewall. It decouples the controller network from the host subsystem by use of a dual ported RAM. This prevents the propagation of control errors. The interface to the host CPU is implemented as 16 bit wide non-multiplexed asynchronous bus interface.
TTP/C follows a conflict-free media access strategy called time-division-multiple access (TDMA). This means, TTP/C deploys a time slot technique based on a global time which is
permanently synchronised. Each node is assigned a time slot in which it is allowed to perform transmit operation. The sequence of time slots is called TDMA round, a set of TDMA rounds
forms a cluster cycle. After one cluster cycle the operation of the network repeats.
The sequence of interactions forming the cluster cycle is defined in a static time schedule, called message-descriptor-list (MEDL). The definition of the MEDL in conjunction with the global time determines the response time for a service request. The membership of all nodes in the network is evaluated by the communication controller. This information is presented in a consistent fashion to all correct cluster members. During operation, the status of every other node is propagated within one TDMA round. The MEDL is loaded into the configuration memory when the system starts up.
| SYMBOL | PARAMETER | MIN | MAX | NOTE |
| VDD | DC Supply Voltage | - 0.3 V | 5.0 V | |
| VIN | Input Voltage on any Pin | - 0.3 V | VDD + 0.3 V | |
| IIN | Input Current on any Pin | -100 mA | 100 mA | 25°C |
| Tstrg | Storage Temperature | -55 |
150 | |
| Tsold | Soldering Temperature | 260 |
1) | |
| tsold | Soldering Time | 10 sec | Reflow and Wave | |
| H | Humidity | 5 % | 85 % | |
| ESD | Electrostatic Discharge | 1000 V | HBM: R = 1.5 k, C = 100 pF |
AS8202
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