AT73C204

Output Voltage Range :
Output Current :
Input Voltage Range :
Input Current :
Power Dissipation :
Operating Temperature Range :
Packaging :
Mounting Style : SMD/SMT
Package / Case : BGA-49


Features:

• 300 mA/1.9V/2.5V DC to DC for Co-processor Core
• 80 mA/2.8V Dual-mode LDO for Memories (LDO1)
• 130 mA/2.7V/2.8V LDO for Camera Module (LDO2)
• 130 mA/2.8V LDO for Analog Section Supply of Audio Stereo Codec (LDO6)
• 10 mA/1.8V/2.8V LDO for Digital Section Supply of Audio Stereo Codec (LDO7)
• 130 mA/2.8V LDO for Analog Section Supply of Bluetooth^® Module (LDO4)
• 130 mA/2.8V LDO for Digital Section Supply of Bluetooth^® Module (LDO5)
• 2 mA/2.4V/2.7V LDO for Low-power Device Control (LDO3)
• Open Drain Switch
• Three-channel Level Shifters
• LED Driver
• 0.5 mA/1.5V Bufferized Voltage Reference
• Power Management Start-up Controller and Reset Generation
• Over- and Under-voltage Protections
• Over-temperature Protection
• Shutdown, Sleep and Enable Modes
• Straightforward and Easy Interfacing to any Baseband Controller
• Small 5 mm x 5 mm, 49-ball BGA Package



Specifications

Operating Temperature (Industrial)...... -40°C to +85°C Storage Temperature ............. -55°C to + 150°C Power Supply Input VINA, VINB,...,VINF .................. -0.3V to +6.5V I/O Input (all except to power supply... -0.3V to VMAX+0.3

*NOTICE: Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functio-nal operation of the device at these or other conditions be-yond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device re-liability.

Description

The AT73C204 device provides an integrated power management solution for the addon multimedia features in new-generation mobile phones. These features include a camera module, sound system for polyphonic ringing tones, memory module for downloaded MP3 files, Bluetooth module for cordless headset, etc. The most common approach to the IC architecture of these new-generation mobile phones is a baseband processor for the basic telephony functions and a separate co-processor for the multimedia features. Atmel proposes the AT73C202 for power management of the baseband processor and RF elements, and the AT73C204 for power management of
the multimedia features.

The AT73C204 is suitable for any telecommunications standard: GSM/GPRS, PDS, CDMA, CDMA2000, WCDMA or UMTS. It is packaged in a small form-factor 49-ball 5 mm x 5 mm BGA package.


Parameters:

Technical/Catalog Information	AT73C204
Vendor	Atmel
Category	Integrated Circuits (ICs)
Applications	Cell Phone
Current - Supply	-
Voltage - Supply	-
Package / Case	48-FBGA
Packaging	Tape & Reel (TR)
Lead Free Status	Contains Lead
RoHS Status	RoHS Non-Compliant
Other Names	AT73C204 AT73C204