ATS-52325P-C2-R0, US $ 3.6-5.52, ATS-52325P-C2-R0 DataSheet download, circuit diagram from SeekIC.com

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SeekIC No. : 003444434 Detail

ATS-52325P-C2-R0: HEAT SINK 32.5 X 32.5 X 17.5MM

ATS-52325P-C2-R0 Data Sheet

US $ 3.6~5.52 / Piece | Get Latest Price

Part Number:: ATS-52325P-C2-R0
Mfg:
Supply Ability:: 5000

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0~1
1~10
10~100

Unit Price
$5.52
$4.22
$3.6

Processing time
15 Days
15 Days
15 Days

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Upload time: 2024/4/26

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Product Details

Quick Details

Capacitance :	6 pF	Series:	maxiFLOW
Manufacturer:	Advanced Thermal Solutions Inc	Type:	Top Mount
Package Cooled:	BGA	Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Angled Fins	Length:	1.280" (32.51mm)
Width:	1.280" (32.51mm)	Diameter:	-
Height Off Base (Height of Fin):	0.689" (17.50mm)	Power Dissipation @ Temperature Rise:	-
Thermal Resistance @ Forced Air Flow:	2.7°C/W @ 200 LFM	Thermal Resistance @ Natural:	-
Material:	Aluminum

Description

Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Package Cooled: BGA
Thermal Resistance @ Natural: -
Type: Top Mount
Attachment Method: Thermal Tape, Adhesive (Included)
Series: maxiFLOW
Manufacturer: Advanced Thermal Solutions Inc
Shape: Square, Angled Fins
Material Finish: Blue Anodized
Length: 1.280" (32.51mm)
Width: 1.280" (32.51mm)
Height Off Base (Height of Fin): 0.689" (17.50mm)
Thermal Resistance @ Forced Air Flow: 2.7°C/W @ 200 LFM

Parameters:

Technical/Catalog Information	ATS-52325P-C2-R0
Vendor	Advanced Thermal Solutions Inc
Category	Thermal Management
Attachment Method	Thermal Tape, Adhesive (Included)
Height	0.69" (17.53mm)
Material	Aluminum
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise	-
Thermal Resistance @ Forced Air Flow	2.7°C/W @ 200 LFM
Outline	32.50mm x 32.50mm
Thermal Resistance @ Natural	-
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	ATS 52325P C2 R0 ATS52325PC2R0 ATS1140 ND ATS1140ND ATS1140

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ATS-52325P-C2-R0

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