HEAT SINK 31MM X 31MM X 19.5MM
ATS-55310R-C2-R0: HEAT SINK 31MM X 31MM X 19.5MM
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| Capacitance : | 16.5 pF | Series: | - |
| Manufacturer: | Advanced Thermal Solutions Inc | Type: | Top Mount |
| Package Cooled: | BGA | Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins | Length: | 1.220" (30.99mm) |
| Width: | 1.220" (30.99mm) | Diameter: | - |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) | Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 5.3°C/W @ 200 LFM | Thermal Resistance @ Natural: | - |
| Material: | Aluminum |
| Technical/Catalog Information | ATS-55310R-C2-R0 |
| Vendor | Advanced Thermal Solutions Inc |
| Category | Thermal Management |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Height | 0.77" (19.5mm) |
| Material | Aluminum |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 5.3°C/W @ 200 LFM |
| Outline | 31.00mm x 31.00mm |
| Thermal Resistance @ Natural | - |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | ATS 55310R C2 R0 ATS55310RC2R0 ATS1306 ND ATS1306ND ATS1306 |