ATS-56006-C3-R0

HEAT SINK 50MM X 45MM X 12.5MM

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ATS-56006-C3-R0 Picture
SeekIC No. : 003444583 Detail

ATS-56006-C3-R0: HEAT SINK 50MM X 45MM X 12.5MM

floor Price/Ceiling Price

US $ 6.56~10.05 / Piece | Get Latest Price
Part Number:
ATS-56006-C3-R0
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 0~1
  • 1~10
  • 10~100
  • Unit Price
  • $10.05
  • $7.69
  • $6.56
  • Processing time
  • 15 Days
  • 15 Days
  • 15 Days
View more price & deliveries
Total Cost: $ 0.00

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Upload time: 2024/3/28

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Product Details

Quick Details

Capacitance : 16.5 pF Series: maxiFLOW
Manufacturer: Advanced Thermal Solutions Inc Type: Top Mount
Package Cooled: ASIC Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Rectangular, Angled Fins Length: 1.969" (50.00mm)
Width: 1.772" (45.00mm) Diameter: -
Height Off Base (Height of Fin): 0.472" (12.00mm) Power Dissipation @ Temperature Rise: -
Thermal Resistance @ Forced Air Flow: 3.9°C/W @ 200 LFM Thermal Resistance @ Natural: -
Material: Aluminum    

Description

Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Thermal Resistance @ Natural: -
Type: Top Mount
Attachment Method: Thermal Tape, Adhesive (Included)
Series: maxiFLOW
Manufacturer: Advanced Thermal Solutions Inc
Package Cooled: ASIC
Width: 1.772" (45.00mm)
Length: 1.969" (50.00mm)
Shape: Rectangular, Angled Fins
Thermal Resistance @ Forced Air Flow: 3.9°C/W @ 200 LFM
Height Off Base (Height of Fin): 0.472" (12.00mm)


Parameters:

Technical/Catalog InformationATS-56006-C3-R0
VendorAdvanced Thermal Solutions Inc
CategoryThermal Management
Attachment MethodThermal Tape, Adhesive (Included)
Height0.49" (12.5mm)
MaterialAluminum
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow3.9°C/W @ 200 LFM
Outline50.00mm x 45.00mm
Thermal Resistance @ Natural-
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names ATS 56006 C3 R0
ATS56006C3R0
ATS1337 ND
ATS1337ND
ATS1337



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