HEAT SINK 32MM X 50MM X 12MM
ATS-59004-C2-R0: HEAT SINK 32MM X 50MM X 12MM
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| Capacitance : | 16.5 pF | Series: | maxiGRIP |
| Manufacturer: | Advanced Thermal Solutions Inc | Type: | Top Mount |
| Package Cooled: | Flip Chip Processors | Attachment Method: | Clip |
| Shape: | Rectangular, Angled Fins | Length: | 1.260" (32.00mm) |
| Width: | 1.969" (50.00mm) | Diameter: | - |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) | Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 3.2°C/W @ 200 LFM | Thermal Resistance @ Natural: | - |
| Material: | Aluminum |
| Technical/Catalog Information | ATS-59004-C2-R0 |
| Vendor | Advanced Thermal Solutions Inc |
| Category | Thermal Management |
| Attachment Method | Clip |
| Height | 0.47" (12mm) |
| Material | Aluminum |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 3.2°C/W @ 200 LFM |
| Outline | 50.00mm x 32.00mm |
| Thermal Resistance @ Natural | - |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | ATS 59004 C2 R0 ATS59004C2R0 ATS1369 ND ATS1369ND ATS1369 |