Features: - On-chip Hall sensor - Bi-direction H type output drivers for single coil - Internal bandgap regulator allows temperature compensated operations and a wide operating voltage range - High output sinking capability up to 250mA - Operating voltage: 3.5V~20V - Low output switching current n...
ATS477: Features: - On-chip Hall sensor - Bi-direction H type output drivers for single coil - Internal bandgap regulator allows temperature compensated operations and a wide operating voltage range - High ...
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Characteristics |
Symbol |
Values |
Unit | |
Supply voltage |
VCC |
20 |
V | |
Magnetic flux density |
B |
Unlimited | ||
Output "on" current | Continuous |
Ic |
250 |
mA |
Hold |
300 | |||
Peak (Start Up) |
600 | |||
Operating temperature range |
Ta |
-20~+85 |
°C | |
Storage temperature range |
Ts |
-65~+150 |
°C | |
Package Power | SIP-4L |
PD |
550 |
mW |
Dissipation | SOP-7L |
800 |
mW (Note 1) |
ATS477 that integrates Hall sensor with output drivers is designed for electrical commutation of brush-less DC motor application. The device includes on-chip Hall voltage generator for magnetic sensing, the error amplifier that amplifies the Hall voltage, a comparator that is to provide switching hysteresis for noise rejection, the bi-direction drivers for sinking and driving large current load, and the frequency generator (FG) that provides a signal proportional to rotation speed. Internal bandgap regulator is used to provide temperature compensated bias for internal circuits and allows a wide operating supply voltage range. Built-in protection circuit and output shunt Zener diodes were applied for protecting output drivers during operating.
If a magnetic flux density is larger than threshold Bop, DO is turned to sink and DOB is turned to drive. The output state is held until a magnetic flux density reversal falls below Brp causing DO to be turned to drive and DOB turned to sink. ATS477 is rated for operation over-temperature range from -20 to 85 and voltage range from 3.5V to 20V. The devices are available in low cost die forms or rugged SIP-4L and power SOP-7L packages.