B048K120T10

Features: • 48V to 12V V•I Chip Converter• 100 Watt (150 Watt for 1 ms)• High density up to 400 W/in3• Small footprint 100 W/in2• Low weight 0.4 oz (12 g)• Pick & Place / SMD• >96% efficiency• 125°C operation• <1 s transient ...

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SeekIC No. : 004293571 Detail

B048K120T10: Features: • 48V to 12V V•I Chip Converter• 100 Watt (150 Watt for 1 ms)• High density up to 400 W/in3• Small footprint 100 W/in2• Low weight 0.4 oz (12 g)̶...

floor Price/Ceiling Price

Part Number:
B048K120T10
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/28

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Product Details

Description



Features:

• 48V to 12V V•I Chip Converter
• 100 Watt (150 Watt for 1 ms)
• High density up to 400 W/in3
• Small footprint 100 W/in2
• Low weight 0.4 oz (12 g)
• Pick & Place / SMD
• >96% efficiency
• 125°C operation
• <1 s transient response
• >3.5 million hours MTBF
• No output filtering required
• V•I ChipBGA package



Specifications

Parameter Values Unit Notes
+In to -In -1.0 to 60.0 Vdc  
+In to -In 100 Vdc For 100 ms
PC to -In -0.3 to 7.0 Vdc  
TM to -In -0.3 to 7.0 Vdc  
SG to -In 500 mA  
+Out to -Out -0.3 to 7.0 Vdc  
Isolation voltage 1500 Vdc For 100 ms
Operating junction temperature -40 to 125 °C See note 2
Output current 8.3 A Continuous
Peak output current 12.5 A Continuous
Case temperature during reflow 208 °C  
Storage temperature -40 to 150 °C  
Output power 100 W Continuous
Peak output power 150 W For 1 ms



Description

The V•I Chip Bus Converter Module (BCM) B048K120T10 is a high efficiency (>96%),narrow input range Voltage Transformation Module (VTM) operating from a pre regulated 48 Vdc primary bus to deliver an isolated 12 V secondary for Intermediate Bus Architecture applications. The BCM may be used to power non isolated POL converters or as an independent 12 V source. Due to the fast response time and low noise of the BCM B048K120T10, the need for limited life aluminum electrolytic or tantalum capacitors at the input of POL converters is reduced-or eliminated-resulting in savings of board area, materials and total system cost.

The BCM B048K120T10 achieves a power density of 400 W/in3 and may be surface mounted with a profile as low as 0.16" (4mm) over the PCB. Its V•I Chip power BGA package is compatible with on-board or in-board surface mounting. The V•I Chip package provides flexible thermal management through its low Junction-to-Case and Junction-to-BGA thermal resistance.Owing to its high conversion efficiency and safe operating temperature range, the BCM B048K120T10 does not require a discrete heat sink in typical applications. It is also compatible with heat sink options,assuring low junction temperatures and long life in the harshest environments.


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