B048K160T24

Features:

• 48 V to 16 V V•I Chip Converter
• 240 Watt (360 Watt for 1 ms)
• High density 974 W/in3
• Small footprint 220 W/in2
• Low weight 0.5 oz (14 g)
• ZVS/ZCS isolated Sine Amplitude Converter
• Typical efficiency 96%
• 125°C operation
• <1 s transient response
• 3.5 million hours MTBF
• No output filtering required
• Surface mount BGA or J-Lead packages


Specifications

Parameter	Values	Unit	Notes
+In to -In	-1.0 to 60	Vdc
+In to -In	100	Vdc	For 100 ms
PC to -In	-0.3 to 7.0	Vdc
+Out to -Out	-0.5 to 15.0	Vdc
Isolation voltage	2,250	Vdc	Input to Output
Output current	20	A	Continuous
Peak output current	22.5	A	For 1 ms
Output power	240	W	Continuous
Peak output power	360	W	For 1 ms
Case temperature	208	°C	During reflow
Operating junction temperature(1)	-40 to 125 -55 to 125	°C °C	T - Grade M - Grade
Storage temperature	-40 to 150 -65 to 150	°C °C	T - Grade M - Grade

Description

The V•I Chip Bus Converter Module (BCM) B048K160T24 is a high efficiency (>96%), narrow input range Sine Amplitude Converter (SAC) operating from a 38 to 55 Vdc primary bus to deliver an isolated 12.7 V to 18.3 V secondary.The BCM may be used to power non-isolated POL converters or as an independent 12.7 18.3 V source.Due to the fast response time and low noise of the BCM B048K160T24, the need for limited life aluminum electrolytic or tantalum capacitors at the load is reduced-or eliminated-resulting in savings of board area, materials and total system cost.

The BCM B048K160T24 achieves a power density of 974 W/in3 and may be surface mounted with a profile as low as 0.16" (4 mm) over the PCB. Its V•I Chip power package is compatible with onboard or inboard surface mounting.The V•I Chip package provides flexible thermal management through its low Junction-to-Case and Junction-to-BGA thermal resistance. Owing to its high conversion efficiency and safe operating temperature range, the BCM B048K160T24 does not require a discrete heat sink in typical applications. Low junction to case and junction to lead thermal impedances assure low junction temperatures and long life in the harshest environments.