HEATSINK CPU W/ADHESIVE 1.51"SQ
BDN15-3CB/A01: HEATSINK CPU W/ADHESIVE 1.51"SQ
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| Capacitance : | 16.5 pF | Series: | BDN |
| Manufacturer: | CTS Thermal Management Products | Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) | Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins | Length: | 1.51" (38.35mm) |
| Width: | 1.510" (38.35mm) | Diameter: | - |
| Height Off Base (Height of Fin): | 0.355" (9.02mm) | Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 4.5°C/W @ 400 LFM | Thermal Resistance @ Natural: | 15.1°C/W |
| Material: | Aluminum |
| Technical/Catalog Information | BDN15-3CB/A01 |
| Vendor | CTS Thermal Management Products |
| Category | Fans, Thermal Management |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Height | 0.35" (9mm) |
| Material | Aluminum |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 4.5°C/W @ 400 LFM |
| Outline | 38.35mm x 38.35mm |
| Thermal Resistance @ Natural | 15.1°C/W |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | BDN15 3CB A01 BDN153CBA01 294 1102 ND 2941102ND 294-1102 |