HEATSINK CPU W/ADHESIVE 1.61"SQ
BDN16-3CB/A01: HEATSINK CPU W/ADHESIVE 1.61"SQ
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
| Capacitance : | 16.5 pF | Series: | BDN |
| Manufacturer: | CTS Thermal Management Products | Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) | Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Pin Fins | Length: | 1.610" (40.89mm) |
| Width: | 1.610" (40.89mm) | Diameter: | - |
| Height Off Base (Height of Fin): | 0.355" (9.02mm) | Power Dissipation @ Temperature Rise: | - |
| Thermal Resistance @ Forced Air Flow: | 4.5°C/W @ 400 LFM | Thermal Resistance @ Natural: | 13.5°C/W |
| Material: | Aluminum |
| Technical/Catalog Information | BDN16-3CB/A01 |
| Vendor | CTS Thermal Management Products |
| Category | Fans, Thermal Management |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Height | 0.35" (9mm) |
| Material | Aluminum |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 4.5°C/W @ 400 LFM |
| Outline | 40.89mm x 40.89mm |
| Thermal Resistance @ Natural | 13.5°C/W |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | BDN16 3CB A01 BDN163CBA01 294 1103 ND 2941103ND 294-1103 |