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MFG:-  Package Cooled:TO  D/C:9519  

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Part Number: BU4SU69

 

MFG: -

Package Cooled: TO

D/C: 9519

Description: The BU4SU69 is an ultra-compact IC with one circuit of the bufferless inverter, BU4069UB, built into the SMP package. T...


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BU4SU69 General Description


The BU4SU69 is an ultra-compact IC with one circuit of the bufferless inverter, BU4069UB, built into the SMP package. The single-stage gate configuration enables a short propagation time.

BU4SU69 Maximum Ratings

 Parameter  Symbol  Limits  Unit
 Power supply voltage  VDD  VSS 0.3 ~ VSS + 18  V
 Power dissipation  Pd  170  mW
 Input current  IIN   10  mA
 Operating temperature  Topr    40 ~ + 85  
 Storage temperature  Tstg    55 ~ + 150  
 Input voltage  VIN  VSS 0.3 ~ VDD + 0.3  V

1 These values indicate the limits at which voltage can be applied to the terminal without causing destruction, but operation is not guaranteed at these values.
2 Power dissipation is reduced by 1.7mW for each increase in Ta of 1°C over 25°C.

BU4SU69 Features

1) Low current dissipation.
2) Super-mini mold package designed for surface mounting.
3) Wide range of operating power supply voltage.
4) Direct drive of 2 L-TTL inputs and 1 LS-TTL input.

BU4SU69 datasheet

BU4SU69
PDF/DataSheet Download

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