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MFG:SIEMENS Package Cooled:TO-3P D/C:05+

MFG:SIEMENS Package Cooled:TO-3P D/C:05+

| Parameter | Symbol | Values | Unit |
| VDS | 400 | V | |
| VDGR | 400 | ||
| Continuous drain current TC = 28 °C |
ID | 12.5 |
A |
| Pulsed drain current TC = 25 °C |
IDpuls | 50 | |
| Gate source voltage | VGS | ± 20 | V |
| Power dissipation TC = 25 °C |
Ptot | 125 |
W |
| Operating temperature | Tj | -55 ... + 150 | °C |
| Storage temperature | Tstg | -55 ... + 150 | |
| Thermal resistance, chip case | RthJC | 1 | K/W |
| Thermal resistance, chip to ambient | RthJA | 75 | |
| DIN humidity category, DIN 40 040 | E | ||
| IEC climatic category, DIN IEC 68-1 | 55 / 150 / 56 |
BUZ382
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