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MFG:PHILIPS  Package Cooled:SOD64  D/C:09+  

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Part Number: BY328

 

MFG: PHILIPS

Package Cooled: SOD64

D/C: 09+

Description: Rugged glass package, using a high temperature alloyed construction.This package is hermetic...


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BY328 General Description


Rugged glass package, using a high temperature alloyed construction.

This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched.

BY328 Maximum Ratings

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VRSM non-repetitive peak
reverse voltage		 1500 V
VRRM repetitive peak reverse voltage 1500 V
VR continuous reverse voltage 1400 V
I FWM working peak forward current Ttp =55 °C; lead length = 10 mm
see Fig.2
Tamb =55 °C; PCB mounting (see
Fig.5); see Fig.2
Tamb =55 °C; PCB mounting (see
Fig.4); see Fig 2

6.0

4.7

3.0

 A
I FRM repetitive peak forward current 10 A
IFSM non-repetitive peak forward current t = 10 ms half sinewave;
Tj =Tj max prior to surge;
VR =VRRMmax		 60

 A
Tstg storage temperature -40 +150
Tj operating junction temperature +150

BY328 Features

* Glass passivated
* High maximum operating temperature
* Low leakage current
* Excellent stability
* Available in ammo-pack
* Also available with preformed leads for easy insertion.

BY328 Typical Application

* Damper diode in high frequency horizontal deflection circuits up to 38 kHz.

BY328 Connection Diagram

BY328 Connection Diagram

BY328 datasheet

BY328
PDF/DataSheet Download

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