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BYG60

Features: · Glass passivated· High maximum operating temperature · Low leakage current· Excellent stability· Guaranteed avalanche energy absorption capability· UL 94V-O classified plastic package· Shipped in 12 mm embossed tape.Specifications SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT ...

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SeekIC No. : 004305548 Detail

BYG60: Features: · Glass passivated· High maximum operating temperature · Low leakage current· Excellent stability· Guaranteed avalanche energy absorption capability· UL 94V-O classified plastic package· S...

BYG60 Data Sheet

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Part Number:
BYG60
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/29

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Product Details

Description



Features:

· Glass passivated
· High maximum operating temperature
· Low leakage current
· Excellent stability
· Guaranteed avalanche energy absorption capability
· UL 94V-O classified plastic package
· Shipped in 12 mm embossed tape.


Specifications

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VRRM repetitive peak reverse voltage
BYG60D
BYG60G
BYG60J
BYG60K
BYG60M		   -
-
-
-
-
 200
400
600
800
1000		 V
V
V
V
V
VR continuous reverse voltage
BYG60D
BYG60G
BYG60J
BYG60K
BYG60M		   -
-
-
-
-		 200
400
600
800
1000		 V
V
V
V
V
IF(AV) average forward current averaged over any 20 ms period;
Ttp = 100 °C; see Fig.2

 - 1.9 A
averaged over any 20 ms period;
Al2O3 printed-circuit board mounting
(see Fig.7); Tamb = 60 °C; see Fig.3		 - 0.9 A
averaged over any 20 ms period;
epoxy printed-circuit board mounting
(see Fig.7); Tamb = 60 °C; see Fig.3		 - 0.65 A
IFSM non-repetitive peak forward current t = 10 ms half sine wave;
Tj = Tj max prior to surge;
VR = VRRMmax		 - 25 A



Description

DO-214AC surface mountable package BYG60 with glass passivated chip.

The well-defined void-free case of BYG60 is of a transfer-moulded thermo-setting plastic.




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