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Part Number: BZG01
Description: DO-214AC surface mountable package with glass passivated chip.The well-defined void-free case ...


Description: DO-214AC surface mountable package with glass passivated chip.The well-defined void-free case ...
DO-214AC surface mountable package with glass passivated chip.
The well-defined void-free case is of a transfer-moulded thermo-setting plastic. The small rectangular package has two J bent leads.
| SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
| Ptot | total power dissipation | Ttp = 100 °C; see Fig.2 | - | 2.50 | W |
| Ptot | total power dissipation | Tamb = 25 °C; see Fig.2; device mounted on an Al2O3 PCB (see Fig.5) | - | 1.50 | W |
| PZSM | non-repetitive peak reverse power dissipation | tp = 100 ms; square pulse; Tj = 25 °C prior to surge; see Fig.3 |
- | 150 | W |
| Tstg | storage temperature | -65 | +175 | °C | |
| Tj | junction temperature | -65 | +175 | °C |
BZG01
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