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Part Number: BZG01

 

 

 

 

Description: DO-214AC surface mountable package with glass passivated chip.The well-defined void-free case ...


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BZG01 General Description


DO-214AC surface mountable package with glass passivated chip.

The well-defined void-free case is of a transfer-moulded thermo-setting plastic. The small rectangular package has two J bent leads.

BZG01 Maximum Ratings

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Ptot total power dissipation Ttp = 100 °C; see Fig.2 - 2.50 W
Ptot total power dissipation Tamb = 25 °C; see Fig.2; device mounted on an Al2O3 PCB (see Fig.5) - 1.50 W
PZSM non-repetitive peak reverse power dissipation tp = 100 ms; square pulse;
Tj = 25 °C prior to surge; see Fig.3
- 150 W
Tstg storage temperature   -65 +175 °C
Tj junction temperature   -65 +175 °C

BZG01 Features

· Glass passivated
· High maximum operating temperature
· Ideal for surface mount automotive applications
· Low leakage current
· Excellent stability
· UL 94V-O classified plastic package
· Zener working voltage range: 10 to 270 V for 35 types
· Supplied in 12 mm embossed tape and reel, 1500 and 7500 pieces
· Marking: cathode, date code, type name
· Easy pick and place.

BZG01 datasheet

BZG01
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