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MFG:PHILIPS Package Cooled:SOD-15
Part Number: BZG03
MFG: PHILIPS
Package Cooled: SOD-15
Description: DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case...
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BZG03
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DataSheet
General Description
BZG03 General Description
DO-214AC surface mountable package with glass passivated chip.
The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
BZG03 Maximum Ratings
| SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
| Ptot | total power dissipation | Ttp = 100 °C; see Fig.2 | - | 3.00 | W |
| Ptot | total power dissipation | Tamb = 50 °C; see Fig.2; device mounted on an Al2O3 PCB (see Fig.5) | - | 1.25 | W |
| PZSM | non-repetitive peak reverse power dissipation | tp = 100 ms; square pulse; Tj = 25 °C prior to surge; see Fig.3 |
- | 600 | W |
| Tstg | storage temperature | -65 | +175 | °C | |
| Tj | junction temperature | -65 | +175 | °C |
BZG03 Features
· Glass passivatedb
· High maximum operating temperature
· Low leakage current
· Excellent stability
· UL 94V-O classified plastic package
· Zener working voltage range: 10 to 270 V for 35 types
· Supplied in 12 mm embossed tape.
· High maximum operating temperature
· Low leakage current
· Excellent stability
· UL 94V-O classified plastic package
· Zener working voltage range: 10 to 270 V for 35 types
· Supplied in 12 mm embossed tape.
BZG03
PDF/DataSheet Download
- Datasheet: BZG03
- File Size: 32309 KB
- Manufacturer: PHILIPS [Philips Semiconductors]
- Click here to Download
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DO-214AC surface mountable package with glass passivated chip.The well-defined void-free case is of a transfer-moulded thermo-setting plastic. The small rectangular package of BZG01has two J bent leads.
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