CE77

Features: • Technology : 0.25 mm silicon-gate CMOS, 3- to 4-layer wiring• Supply voltage : +2.5 V ± 0.2 V (normal) to +1.5 V ± 0.1 V• Junction temperature range : -40 °C to +125 °C• Gate delay time : tpd = 33 ps (2.5 V, inverter cell High Speed type, F/O = 1, No load)•...

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CE77 Picture
SeekIC No. : 004312648 Detail

CE77: Features: • Technology : 0.25 mm silicon-gate CMOS, 3- to 4-layer wiring• Supply voltage : +2.5 V ± 0.2 V (normal) to +1.5 V ± 0.1 V• Junction temperature range : -40 °C to +125 °C...

floor Price/Ceiling Price

Part Number:
CE77
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/27

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Product Details

Description



Features:

• Technology : 0.25 mm silicon-gate CMOS, 3- to 4-layer wiring
• Supply voltage : +2.5 V ± 0.2 V (normal) to +1.5 V ± 0.1 V
• Junction temperature range : -40 °C to +125 °C
• Gate delay time : tpd = 33 ps (2.5 V, inverter cell High Speed type, F/O = 1, No load)
• Gate power consumption : 0.02 mW/MHz (1.5 V, F/O = 1, No load)
• High-load driving capability : IOL = 2 mA/4 mA/8 mA/12 mA mixable
• Output buffer cells with noise reduction circuits
• Inputs with on-chip input pull-up/pull-down resistors (25 kW typical) and bidirectional buffer cells
• Buffer cells dedicated to crystal oscillator
• Special interfaces (P-CML, LVDS, T-LVTTL, SSTL, PCI, USB, GTL+, and others including those under
development)
• IP macros (CPU, PCI, USB, IrDA, PLL, DAC, ADC, and others including those under development)
• Capable of incorporating compiled cells (RAM/ROM/FIFO/Delay line, and others.)
• Configurable internal bus circuits
• Advanced hardware/software co-design environment
• Support for static timing sign-off Dramatically reducing the time for generating test vectors for timing verification and the simulation time
• Hierarchical design environment for supporting large-scale circuits
• Simulation (before layout) considering the input slew rate and detailed RC delay calculation (after layout) , supporting development with minimized timing trouble after trial manufacture
• Support for memory (RAM/ROM) SCAN
• Support for memory (RAM) BIST
• Support for boundary SCAN
• Support for path delay test
• A variety of package options (QFP, TQFP, LQFP, HQFP, BGA, T-BGA, FCBGA under development)




Specifications

Parameter
Symbol
Application
Rating
Unit
Min
Max
Supply voltage
VDD
VDD = 1.4 V to 2.7 V
- 0.5
+3.0*3
+4.0*4
V
VDD = 2.7 V to 3.6 V
VDD + 0.5 ( £ 3.0 V) *3
Input voltage
VI
--
- 0.5
VDD + 0.5 ( £ 4.0 V) *4
V
VDD + 0.5 ( £ 3.0 V) *3
Output voltage
VO
--
- 0.5
VDD + 0.5 ( £ 4.0 V) *4
V
+125
Storage temperature
Tst
--
-55
+125
°C
Junction temperature
Tj
--
-40
±13
°C
Output current*1
L type
IO
Powerless type
(IOL = 2 mA)
--
±13
mA
M type Nomal type
(IOL = 4 mA)
--
±13
mA
H type Power type
(IOL = 8 mA)
--
±26
mA
V type High power type
(IOL = 12 mA)
--
60
mA
Power-supply pin current *2
ID
Per VDD, GND pin
--
30
mA



Description

The CE77 series 0.25 mm CMOS embedded array is a line of highly integrated CMOS ASICs featuring high speed and low power consumption at the same time.

CE77 series is available in 15 frames with the enhanced lineup of 470 K to 6980 K gates.




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