DescriptionThe CPC1786 is one of i4-PAC™ DC Power Relay.There are twelve Applications of The CPC1786.The first of all is that it has Industrial Controls.The second is that it has Motor Control.The third is that it has Robotics .The forth is that it has Medical Equipment-Patient/Equipment Iso...
CPC1786: DescriptionThe CPC1786 is one of i4-PAC™ DC Power Relay.There are twelve Applications of The CPC1786.The first of all is that it has Industrial Controls.The second is that it has Motor Control...
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The CPC1786 is one of i4-PAC™ DC Power Relay.
There are twelve Applications of The CPC1786.The first of all is that it has Industrial Controls.The second is that it has Motor Control.The third is that it has Robotics .The forth is that it has Medical Equipment-Patient/Equipment Isolation.The fifth is that it has Instrumentation.The sixth is that it has Multiplexers.The seventh is that it has Data Acquisition.The eighth is that it has Electronic Switching.The ninth is that it has I/O Subsystems.The tenth is that it has Meters (Watt-Hour, Water, Gas).The eleventh is that it has Transportation Equipment.The twelveth is that it has Aerospace/Defense.
There are twelve Features of The CPC1786.The first of all is that it has 100% Solid State.
The second is that CPC1786 has Compact i4-PAC™ Power PackageThe third is that it has Low Thermal Resistance (0.35°C/W)The forth is that it has 1.75ADC Load Current with 5ºC/W Heat Sink .The fifth is that it has Electrically Non-conductive Thermal Pad for Heat Sink Applications.The sixth is that it has No Moving Parts.The seventh is that it has Low Drive Power Requirements.The eighth is that CPC1786 has Arc-Free With No Snubbine Circuits.The ninth is that it has 2500Vrms Input/Output Isolation.The tenth is that it has No EMI/RFI Generation.The eleventh is thatMachine Insertable, Wave Solderable.
The unique i4-PAC package is pioneered by IXYS,and CPC1786 allows solid state relays to achieve the highest load current and power ratings. There are one important feature of This package,that is an IXYS unique process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB)substrate instead of the usual copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation.