CY7C1021CV26

Features: • Temperature Range- Automotive: 40°C to 125°C• High speed- tAA = 15 ns• Optimized voltage range: 2.5V2.7V• Low active power: 360 mW (max.)• Automatic power-down when deselected• Independent control of upper and lower bits• CMOS for optimum speed...

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CY7C1021CV26 Picture
SeekIC No. : 004319772 Detail

CY7C1021CV26: Features: • Temperature Range- Automotive: 40°C to 125°C• High speed- tAA = 15 ns• Optimized voltage range: 2.5V2.7V• Low active power: 360 mW (max.)• Automatic power-d...

floor Price/Ceiling Price

Part Number:
CY7C1021CV26
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/26

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Product Details

Description



Features:

• Temperature Range
- Automotive: 40°C to 125°C
• High speed
- tAA = 15 ns
• Optimized voltage range: 2.5V2.7V
• Low active power: 360 mW (max.)
• Automatic power-down when deselected
• Independent control of upper and lower bits
• CMOS for optimum speed/power
• Packages offered: 44-pin TSOP II and 44-Lead (400-Mil) Molded SOJ
• Offered in both lead-free and non lead-free packages



Pinout

  Connection Diagram


Specifications

(Above which the useful life may be impaired. For user guidelines,not tested.)
Storage Temperature .............................   65°C to +150°C
Ambient Temperature with
Power Applied.........................................   55°C to +125°C
Supply Voltage on VCC to Relative GND[3] .... ..0.5V to +4.6V
DC Voltage Applied to Outputs
in High-Z State[3] ......................................0.5V to VCC+0.5V
DC Input Voltage[3] ................................ 0.5V to VCC + 0.5V
Current into Outputs (LOW)......................................... 20 mA
Static Discharge Voltage............................................ >2001V
(per MIL-STD-883, Method 3015)
Latch-up Current...................................................... >200 mA



Description

The CY7C1021CV26 is a high-performance CMOS static RAM organized as 65,536 words by 16 bits. This device has an automatic power-down feature that significantly reduces power consumption when deselected.

Writing to CY7C1021CV26 is accomplished by taking Chip Enable (CE) and Write Enable (WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O1 through I/O8), is written into the location specified on the address pins (A0 through A15). If Byte High Enable (BHE) is LOW, then data from I/O pins (I/O9 through I/O16) is written into the location specified on the address pins (A0 through A15).

Reading from the device is accomplished by taking Chip Enable (CE) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins of CY7C1021CV26 will appear on I/O1 to I/O8. If Byte High Enable (BHE) is LOW, then data from memory will appear on I/O9 to I/O16. See the truth table at the end of this data sheet for a complete description of Read and Write modes.

The input/output pins (I/O1 through I/O16) are placed in a high-impedance state when CY7C1021CV26 is deselected (CE HIGH), the outputs are disabled (OE HIGH), the BHE and BLE are disabled (BHE, BLE HIGH), or during a Write operation (CE LOW, and WE LOW).




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