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Part Number: CY7C1356V25

 

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Description: The CY7C1354V25 and CY7C1356V25 are 2.5V, 256K by 36 and 512K by 18 Synchronous-Pip...


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CY7C1356V25 General Description


The CY7C1354V25 and CY7C1356V25 are 2.5V, 256K by 36 and 512K by 18 Synchronous-Pipelined Burst SRAMs, respectivelyspectively. They are designed specifically to support unlimited true back-to-back Read/Write operations without the insertion of wait states. The CY7C1354V25/CY7C1356V25 is equipped with the advanced No Bus Latency™ (NoBL™) logic required to enable consecutive Read/Write operations with data being transferred on every clock cycle. This feature dramatically improves the throughput of data through the SRAM, especially in systems that require frequent Write/Read transitions. The CY7C1354V25/CY7C1356V25 is pin compatible and functionally equivalent to ZBT devices.

All synchronous inputs pass through input registers controlled by the rising edge of the clock. All data outputs pass through output registers controlled by the rising edge of the clock. The clock input is qualified by the Clock Enable (CEN) signal, which when deasserted suspends operation and extends the previous clock cycle. Maximum access delay from the clock rise is 3.2 ns (200-MHz device).

Write operations are controlled by the Byte Write Selects (BWSaBWSd for CY7C1354V25 and BWSaBWSb for CY7C1356V25) and a Write Enable (WE) input. All writes are conducted with on-chip synchronous self-timed write circuitry.

Three synchronous Chip Enables (CE1, CE2, CE3) and an asynchronous Output Enable (OE) provide for easy bank selection and output three-state control. In order to avoid bus contention, the output drivers are synchronously three-stated during the data portion of a write sequence.

CY7C1356V25 Maximum Ratings

(Above which the useful life may be impaired. For user guidelines, not tested.)
Storage Temperature ..................................... −65°C to +150°C
Ambient Temperature with
Power Applied.................................................. −55°C to +125°C
Supply Voltage on VDD Relative to GND.........−0.5V to +3.6V
DC Voltage Applied to Outputs
in High Z State[12]....................................−0.5V to VDDQ + 0.5V
DC Input Voltage[12] ................................−0.5V to VDDQ + 0.5V
Current into Outputs (LOW)......................................... 20 mA
Static Discharge Voltage .......................................... >2001V
(per MIL-STD-883, Method 3015)
Latch-Up Current.................................................... >200 mA

CY7C1356V25 Features

• Supports 200-MHz bus operations with zero wait states
   -Data is transferred on every clock
• Internally self-timed output buffer control to eliminate the need to use asynchronous OE
• Fully Registered (inputs and outputs) for pipelined operation
• Byte Write capability
• Common I/O architecture
• Single 2.5V power supply
• Fast clock-to-output times
   -3.2 ns (for 200-MHz device)
   -3.5 ns (for 166-MHz device)
   -4.2 ns (for 133-MHz device)
   -5.0 ns (for 100-MHz device)
• Clock Enable (CEN) pin to suspend operation
• Synchronous self-timed writes
• Available in 100 TQFP & 119 BGA Packages
• Burst Capability-linear or interleaved burst order

CY7C1356V25 Connection Diagram

CY7C1356V25  Connection Diagram

CY7C1356V25 datasheet

CY7C1356V25
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