CY7C65640B-56LFXC

Current - Supply: -
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C
Packaging: Tray
Manufacturer: Cypress Semiconductor Corp
Controller Type: USB 2.0 Hub Controller
Series: EZ-USB HX2LP™
Interface: Serial, SPI, USB
Voltage - Supply: 3.15 V ~ 3.45 V
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-QFN (8x8) Sawn


Description

The CY7C65640B-56LFXC is one member of the CY7C65640 series.Cypress's TetraHub(TM) is a high-performance self-powered Universal Serial Bus (USB) 2.0 hub. The Tetra architecture provides four downstream USB ports, with a Transaction Translator (TT) for each port, making it the highest-performance hub possible.This single-chip device, CY7C65640B-56LFXC    incorporates one upstream and four downstream USB transceivers, a Serial Interface Engine (SIE), USB Hub Controller and Repeater, and four TTs.The CY7C65640B-56LFXC    is suitable for standalone hubs, motherboard hubs, and monitor hub applications.

Features of the CY7C65640B-56LFXC are:(1)USB 2.0 hub; (2)four downstream ports; (3)multiple transaction translators-one per downstream port for maximum performance; (4)VID, PID and DID configured from external SPI EEPROM; (5)24-MHz external crystal; (6)small package-quad flat pack, no leads (QFN); (7)integrated upstream pull-up resistor; (8)integrated downstream pull-down resistors for all downstream ports; (9)integrated upstream and downstream series termination resistors; (10)configurable with external SPI EEPROM.

The absolute maximum ratings of the CY7C65640B-56LFXC can be summarized as:(1)supply voltage to ground potential:-0.5 to 4.0V;(2)storage temperature:-65 to 150;(3)ambient temperature with power applied:0 to 70;(4)DC voltage applied to outputs in high Z state:-0.5 to Vcc+0.5V;(5)power dissipation:1.6W.The QFN (Quad Flatpack No Leads), being a lead free package, the electrical contact of the part to the Printed Circuit Board (PCB) is made by soldering the lands on the bottom surface of the package to the PCB. Hence special attention is required to the heat transfer area below the package to provide a good thermal bond to the circuit board.A copper (Cu) fill should be designed into the PCB as a thermal pad under the package. Heat is transferred from the TeraHub through the device's metal paddle on the bottom side of the package. Heat from here is conducted to the PCB at the thermal pad. It is then conducted from the thermal pad to the PCB inner ground plane by a 5 x 5 array of via.

Parameters:

Technical/Catalog Information	CY7C65640B-56LFXC
Vendor	Cypress Semiconductor Corp
Category	Integrated Circuits (ICs)
Controller Type	USB Hub
Interface	SPI Serial
Voltage - Supply	3.15 V ~ 3.45 V
Current - Supply	260mA
Package / Case	56-QFN
Packaging	Tray
Operating Temperature	0°C ~ 70°C
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	CY7C65640B 56LFXC CY7C65640B56LFXC