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Part Number: DS90CF383
Description: The DS90CF383 transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data st...
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DS90CF383
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General Description
DS90CF383 General Description
The DS90CF383 transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted. At a transmit clock frequency of 65 MHz, 24 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per LVDS data channel. Using a 65 MHz clock, the data throughputs is 227 Mbytes/sec.
This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces.
DS90CF383 Maximum Ratings
Supply Voltage (VCC) −0.3V to +4V
CMOS/TTL Input Voltage −0.3V to (VCC + 0.3V)
LVDS Driver Output Voltage −0.3V to (VCC + 0.3V)
LVDS Output Short Circuit Duration Continuous
Junction Temperature +150°C
Storage Temperature −65°C to +150°C
Lead Temperature (Soldering, 4 sec) +260°C
Maximum Package Power Dissipation Capacity @ 25°C
MTD56 (TSSOP) Package: DS90CF383 1.63 W
Package Derating: DS90CF383 12.5 mW/°C above +25°C
ESD Rating (HBM, 1.5 kW, 100 pF) > 7 kV
CMOS/TTL Input Voltage −0.3V to (VCC + 0.3V)
LVDS Driver Output Voltage −0.3V to (VCC + 0.3V)
LVDS Output Short Circuit Duration Continuous
Junction Temperature +150°C
Storage Temperature −65°C to +150°C
Lead Temperature (Soldering, 4 sec) +260°C
Maximum Package Power Dissipation Capacity @ 25°C
MTD56 (TSSOP) Package: DS90CF383 1.63 W
Package Derating: DS90CF383 12.5 mW/°C above +25°C
ESD Rating (HBM, 1.5 kW, 100 pF) > 7 kV
DS90CF383 Features
·20 to 65 MHz shift clock support
·Single 3.3V supply
·Chipset (Tx + Rx) power consumption < 250 mW (typ)
·Power-down mode (< 0.5 mW total)
·Single pixel per clock XGA (1024x768) ready
·Supports VGA, SVGA, XGA and higher addressability.
·Up to 227 Megabytes/sec bandwidth
·Up to 1.8 Gbps throughput
·Narrow bus reduces cable size and cost
·290 mV swing LVDS devices for low EMI
·PLL requires no external components
·Low profile 56-lead TSSOP package
·Falling edge data strobe Transmitter
·Compatible with TIA/EIA-644 LVDS standard
·ESD rating > 7 kV
·Operating Temperature: −40°C to +85°C
·Single 3.3V supply
·Chipset (Tx + Rx) power consumption < 250 mW (typ)
·Power-down mode (< 0.5 mW total)
·Single pixel per clock XGA (1024x768) ready
·Supports VGA, SVGA, XGA and higher addressability.
·Up to 227 Megabytes/sec bandwidth
·Up to 1.8 Gbps throughput
·Narrow bus reduces cable size and cost
·290 mV swing LVDS devices for low EMI
·PLL requires no external components
·Low profile 56-lead TSSOP package
·Falling edge data strobe Transmitter
·Compatible with TIA/EIA-644 LVDS standard
·ESD rating > 7 kV
·Operating Temperature: −40°C to +85°C
DS90CF383 Connection Diagram
DS90CF383
PDF/DataSheet Download
- Datasheet: DS90CF383
- File Size: 222917 KB
- Manufacturer: NSC [National Semiconductor]
- Click here to Download
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