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Part Number: DS90CF386
Description: The DS90CF386 receiver converts the four LVDS data streams (Up to 2.38 Gbps throughput or 297.5 Megabytes/sec bandwidth...
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DS90CF386
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General Description
DS90CF386 General Description
The DS90CF386 receiver converts the four LVDS data streams (Up to 2.38 Gbps throughput or 297.5 Megabytes/sec bandwidth) back into parallel 28 bits of CMOS/TTL data (24 bits of RGB and 4 bits of Hsync, Vsync, DE and CNTL).
Also available is the DS90CF366 that converts the three LVDS data streams (Up to 1.78 Gbps throughput or 223 Megabytes/sec bandwidth) back into parallel 21 bits of CMOS/TTL data (18 bits of RGB and 3 bits of Hsync, Vsync and DE). Both Receivers' outputs are Falling edge strobe. A Rising edge or Falling edge strobe transmitter (DS90C385/DS90C365) will interoperate with a Falling edge strobe Receiver without any translation logic.
The DS90CF386 is also offered in a 64 ball, 0.8mm fine pitch ball grid array (FBGA) package which provides a 44 % reduction in PCB footprint compared to the 56L TSSOP package.
This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces.
DS90CF386 Maximum Ratings
Supply Voltage (VCC) −0.3V to +4V
CMOS/TTL Output Voltage −0.3V to (VCC + 0.3V)
LVDS Receiver Input Voltage −0.3V to (VCC + 0.3V)
Junction Temperature +150°C
Storage Temperature −65°C to +150°C
Lead Temperature (Soldering, 4 sec for TSSOP) +260°C
Solder Reflow Temperature (Soldering, 20 sec for FBGA) +220°C
Maximum Package Power Dissipation Capacity @ 25°C
MTD56 (TSSOP) Package: DS90CF386MTD 1.61 W
MTD48 (TSSOP) Package: DS90CF366MTD 1.89 W
Package Derating:
DS90CF386MTD 12.4 mW/°C above +25°C
DS90CF366MTD 15 mW/°C above +25°C
Maximum Package Power Dissipation Capacity @ 25°C
SLC64A Package:
DS90CF386SLC 2.0 W
Package Derating:
DS90CF386SLC 10.2 mW/°C above +25°C
ESD Rating
(HBM, 1.5 kΩ, 100 pF) > 7 kV
(EIAJ, 0Ω, 200 pF) > 700V
CMOS/TTL Output Voltage −0.3V to (VCC + 0.3V)
LVDS Receiver Input Voltage −0.3V to (VCC + 0.3V)
Junction Temperature +150°C
Storage Temperature −65°C to +150°C
Lead Temperature (Soldering, 4 sec for TSSOP) +260°C
Solder Reflow Temperature (Soldering, 20 sec for FBGA) +220°C
Maximum Package Power Dissipation Capacity @ 25°C
MTD56 (TSSOP) Package: DS90CF386MTD 1.61 W
MTD48 (TSSOP) Package: DS90CF366MTD 1.89 W
Package Derating:
DS90CF386MTD 12.4 mW/°C above +25°C
DS90CF366MTD 15 mW/°C above +25°C
Maximum Package Power Dissipation Capacity @ 25°C
SLC64A Package:
DS90CF386SLC 2.0 W
Package Derating:
DS90CF386SLC 10.2 mW/°C above +25°C
ESD Rating
(HBM, 1.5 kΩ, 100 pF) > 7 kV
(EIAJ, 0Ω, 200 pF) > 700V
DS90CF386 Features
·20 to 85 MHz shift clock support
·Rx power consumption <142 mW (typ) @85MHz Grayscale
·Rx Power-down mode <1.44 mW (max)
·ESD rating >7 kV (HBM), >700V (EIAJ)
·Supports VGA, SVGA, XGA and Single Pixel SXGA.
·PLL requires no external components
·Compatible with TIA/EIA-644 LVDS standard
·Low profile 56-lead or 48-lead TSSOP package
·DS90CF386 also available in a 64 ball, 0.8mm fine pitch
·ball grid array (FBGA) package
·Rx power consumption <142 mW (typ) @85MHz Grayscale
·Rx Power-down mode <1.44 mW (max)
·ESD rating >7 kV (HBM), >700V (EIAJ)
·Supports VGA, SVGA, XGA and Single Pixel SXGA.
·PLL requires no external components
·Compatible with TIA/EIA-644 LVDS standard
·Low profile 56-lead or 48-lead TSSOP package
·DS90CF386 also available in a 64 ball, 0.8mm fine pitch
·ball grid array (FBGA) package
DS90CF386 Connection Diagram
DS90CF386
PDF/DataSheet Download
- Datasheet: DS90CF386
- File Size: 414033 KB
- Manufacturer: NSC [National Semiconductor]
- Click here to Download
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