EBS12UC6APS

Features: • Fully compatible with 8 bytes S.O.DIMM: JEDEC standard outline• 144-pin socket type small outline dual in line memory module (S.O.DIMM) -PCB height: 31.75mm (1.25inch ) -Lead pitch: 0.80mm• 3.3V power supply• Clock frequency: 100MHz/133MHz (max.)• LVTTL in...

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SeekIC No. : 004331275 Detail

EBS12UC6APS: Features: • Fully compatible with 8 bytes S.O.DIMM: JEDEC standard outline• 144-pin socket type small outline dual in line memory module (S.O.DIMM) -PCB height: 31.75mm (1.25inch ) -Lead...

floor Price/Ceiling Price

Part Number:
EBS12UC6APS
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/27

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Product Details

Description



Features:

• Fully compatible with 8 bytes S.O.DIMM: JEDEC standard outline
• 144-pin socket type small outline dual in line memory module (S.O.DIMM)
       -PCB height: 31.75mm (1.25inch )
       -Lead pitch: 0.80mm
• 3.3V power supply
• Clock frequency: 100MHz/133MHz (max.)
• LVTTL interface
• Data bus width: * 64 non-ECC
• Single pulsed /RAS
• 4 Banks can operates simultaneously and independently
• Burst read/write operation and burst read/single write operation capability
• Programmable burst length (BL): 1, 2, 4, 8, Full page
• 2 variations of burst sequence
       -Sequential
       -Interleave
• Programmable /CAS latency (CL): 2, 3
• Byte control by DQMB
• Refresh cycles: 8192 refresh cycles/64ms
• 2 variations of refresh
       -Auto refresh
       -Self refresh



Specifications

Parameter Symbol Value Unit Note
Voltage on any pin relative to VSS VT 0.5 to VDD + 0.5
( 4.6 (Max))
V  
Supply voltage relative to VSS VDD
0.5 to +4.6 V  
Short circuit output current IOS 50 mA  
Power dissipation PD 4 W  
Operating case temperature TA 0 to +70 1
Storage temperature Tstg 55 to +125  



Description

The EBS12UC6APS is 16M words × 64 bits, 1 bank Synchronous Dynamic RAM Small Outline Dual In-line Memory Module (S.O.DIMM), mounted 4 pieces of 256M bits SDRAM (EDS2516APTA) sealed in TSOP package. This module provides high density and large quantities of memory in a small space without utilizing the surface mounting technology. Decoupling capacitors are mounted on power supply line for noise reduction.


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