FDC636P

MOSFET SSOT-6 P-CH -20V

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FDC636P Picture
SeekIC No. : 00161273 Detail

FDC636P: MOSFET SSOT-6 P-CH -20V

floor Price/Ceiling Price

Part Number:
FDC636P
Mfg:
Fairchild Semiconductor
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/26

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Product Details

Quick Details

Transistor Polarity : P-Channel Drain-Source Breakdown Voltage : - 20 V
Gate-Source Breakdown Voltage : +/- 8 V Continuous Drain Current : 2.8 A
Resistance Drain-Source RDS (on) : 0.13 Ohms Configuration : Single Quad Drain
Maximum Operating Temperature : + 150 C Mounting Style : SMD/SMT
Package / Case : SSOT-6 Packaging : Reel    

Description

Mounting Style : SMD/SMT
Packaging : Reel
Transistor Polarity : P-Channel
Drain-Source Breakdown Voltage : - 20 V
Maximum Operating Temperature : + 150 C
Gate-Source Breakdown Voltage : +/- 8 V
Configuration : Single Quad Drain
Resistance Drain-Source RDS (on) : 0.13 Ohms
Package / Case : SSOT-6
Continuous Drain Current : 2.8 A


Features:

·-2.8 A, -20 V. RDS(ON) = 0.130 W @ VGS = -4.5 V RDS(ON) = 0.180 W @ VGS = -2.5 V.
·SuperSOTTM-6 package design using copper lead frame for superior thermal and electrical capabilities.
·High density cell design for extremely low RDS(ON).
·Exceptional on-resistance and maximum DC current capability.



Pinout

  Connection Diagram


Specifications

Symbol
Parameter
Ratings
Units
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
-20
±8
-2.8
-11
1.6
0.8
-55 to 150
V
V
A

W

°C
ID
Drain Current Continuous
Pulsed
(Note 1a)
PD
Power Dissipation for Single Operation (Note 1a)
(Note 1b)
TJ,TSTG Operating and Storage Junction Temperature Range

THERMAL CHARACTERISTICS
RJA
RJC
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1a)
(Note 1)
78
30
°C/W
°C/W



Description

These FDC636P P-Channel logic level enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance. These devices FDC636P are particularly suited for low voltage applications such as cellular phone and notebook computer power management and other battery powered circuits where high-side switching, and low in-line power loss are needed in a very small outline surface mount package.




Parameters:

Technical/Catalog InformationFDC636P
VendorFairchild Semiconductor
CategoryIntegrated Circuits (ICs)
TypeHigh Side Switch
Number of Outputs1
Voltage - Input-
Package / CaseSuperSOT-6
PackagingTape & Reel (TR)
Current Limit2.8A
Internal Switch(s)Yes
Operating Temperature-55°C ~ 150°C
Rds (On)130 mOhm
Drawing Number*
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names FDC636P
FDC636P
FDC636PTR ND
FDC636PTRND
FDC636PTR



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