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HB56G164EJ

Features: · 168-pin socket type package (Dual lead out) -Outline: 133.35 mm (Length) × 25.40 mm (Height) ×9.00 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: tRAC = 60/70 ns (max) tCAC = 20/23 ns (max)· Low power dissipation -Active mode: 3.906/3.486 W (max)...

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SeekIC No. : 004358933 Detail

HB56G164EJ: Features: · 168-pin socket type package (Dual lead out) -Outline: 133.35 mm (Length) × 25.40 mm (Height) ×9.00 mm (Thickness) -Lead pitch: 1.27 mm· Single 5 V (±5%) supply· High speed -Access time: ...

HB56G164EJ Data Sheet

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Part Number:
HB56G164EJ
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

·  168-pin socket type package (Dual lead out)
     - Outline: 133.35 mm (Length) × 25.40 mm (Height) ×9.00 mm (Thickness)
     - Lead pitch: 1.27 mm
·  Single 5 V (±5%) supply
·  High speed
     - Access time: tRAC = 60/70 ns (max)
     tCAC = 20/23 ns (max)
·  Low power dissipation
     - Active mode: 3.906/3.486 W (max)
     - Standby mode (TTL): 378 mW (max)
     (CMOS): 357 mW (max)
·  Buffered input except RAS and DQ
·  4 byte interleave enabled, dual address input (A0/B0)
·  JEDEC standard outline buffered 8-byte DIMM
·  Fast page mode capability
·  1,024 refresh cycles: 16 ms
·  2 variations of refresh
     - RAS -only refresh
     -CAS -before RAS refresh
·  TTL compatible


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
0.5 to +7.0
V
Supply voltage relative to VSS
VCC
0.5 to +7.0
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
5
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56G164EJ belongs to 8 Byte DIMM (Dual In-line Memory Module) family, and has been developed as an optimized main memory solution for 4 and 8 Byte processor applications. The HB56G164EJ is a 1M ×64 dynamic RAM module, mounted 4 pieces of 16-Mbit DRAM (HM5118160) sealed in SOJ package and 2 pieces of 16-bit BiCMOS line driver (74ABT16244) sealed in TSSOP package. An outline of the HB56G164EJ is 168-pin socket type package (dual lead out). Therefore, it makes high density mounting possible without surface mount technology. It provides common data inputs and outputs. Decoupling capacitors are mounted on the module board.




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