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HB56RW832DZJ

Features: ` 72-pin Zig Zag Dual tabs socket type -Outline: 59.69 mm (Length)*25.40 mm (Height) *3.80 mm (Thickness) -Lead pitch: 1.27 mm` Single 3.3 V (+0.3 V, 0.15 V) supply` High speed -Access time: tRAC = 60/70 ns (max) tCAC = 15/18 ns (max)` Low power dissipation -Active mode: 2.74/2.45 W (max...

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SeekIC No. : 004358947 Detail

HB56RW832DZJ: Features: ` 72-pin Zig Zag Dual tabs socket type -Outline: 59.69 mm (Length)*25.40 mm (Height) *3.80 mm (Thickness) -Lead pitch: 1.27 mm` Single 3.3 V (+0.3 V, 0.15 V) supply` High speed -Access tim...

HB56RW832DZJ Data Sheet

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Part Number:
HB56RW832DZJ
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

`  72-pin Zig Zag Dual tabs socket type
     - Outline: 59.69 mm (Length)*25.40 mm (Height) *3.80 mm (Thickness)
     - Lead pitch: 1.27 mm
`  Single 3.3 V (+0.3 V, 0.15 V) supply
`  High speed
     - Access time: tRAC = 60/70 ns (max)
     tCAC = 15/18 ns (max)
`  Low power dissipation
    - Active mode: 2.74/2.45 W (max)
    - Standby mode (TTL): 115.2 mW (max)
     (CMOS): 8.64 mW (max) (L-version)
`  Fast page mode capability
`  Refresh period
     - 2048 refresh cycles: 32 ms
     128 ms- (L-version)
`  3 variations of refresh
     - RAS -only refresh
     -CAS -before-RAS refresh
     - Self refresh (LS-version)


Specifications

Parameter
Symbol
Value
Unit
Voltage on any pin relative to VSS
VT
0.5 to +4.6
V
Supply voltage relative to VSS
VCC
0.5 to +4.6
V
Short circuit output current
Iout
50
mA
Power dissipation
PT
8
W
Operating temperature
Topr
0 to +70
°C
Storage temperature
Tstg
55 to +125
°C



Description

The HB56RW832DZJ is a 8M × 32 dynamic RAM Small Outline Dual In-line Memory Module (S.O.DIMM), mounted 16 pieces of 16-Mbit DRAM (HM51W17400) sealed in TCP package. An outline of the product is 72-pin Zig Zag Dual tabs socket type compact and thin package. Therefore, the product makes high density mounting possible without surface mount technology. The product provides common data inputs and outputs. Decoupling capacitors are mounted on the module board.




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