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HBDM60V600W

Features: · Epitaxial Planar Die Construction· Lead Free By Design/RoHS Compliant (Note 1)· Green Device (Note 2)PinoutSpecifications Parameter Symbol Min Units Power Dissipation (Note 3) Pd 200 °C Thermal Resistance, Junction to Ambient Air (Note 3) RJA 625 ...

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SeekIC No. : 004359074 Detail

HBDM60V600W: Features: · Epitaxial Planar Die Construction· Lead Free By Design/RoHS Compliant (Note 1)· Green Device (Note 2)PinoutSpecifications Parameter Symbol Min Units Power Dissipatio...

HBDM60V600W Data Sheet

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Part Number:
HBDM60V600W
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

· Epitaxial Planar Die Construction
· Lead Free By Design/RoHS Compliant (Note 1)
· "Green" Device (Note 2)




Pinout

Connection Diagram




Specifications

Parameter
Symbol
Min
Units
Power Dissipation (Note 3)
Pd
200
°C
Thermal Resistance, Junction to Ambient Air (Note 3)
RJA
625
°C
Operating and Storage Junction Temperature Range
VEBO
-55 to +150
V

Notes: 1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
3. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on page 8 or on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.



Part Number HBDM60V600W
Product Type NPN + PNP
VCEO (V) 65
-60
IC (A) 0.5
-0.6
ICM (A) -
PD (W) 0.2
hFE Min 100
100
hFE Max 300
@ IC (A) 0.1
-0.15
VCE (SAT) Max (mV) 400
-300
@ IC (A) 0.1
-0.15
@ IB (mA) 10
-15
fT Min (MHz) 100
100
RCE (SAT) (m) -





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