HF115AC-0.0055-AC-105

THERM PAD SIP PKG W/ADH HI-FLOW

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HF115AC-0.0055-AC-105 Picture
SeekIC No. : 003445900 Detail

HF115AC-0.0055-AC-105: THERM PAD SIP PKG W/ADH HI-FLOW

floor Price/Ceiling Price

US $ .03~.08 / Piece | Get Latest Price
Part Number:
HF115AC-0.0055-AC-105
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 0~1
  • 1~10
  • 10~50
  • 50~100
  • 100~500
  • 500~1000
  • 1000~5000
  • 5000~10000
  • Unit Price
  • $.08
  • $.07
  • $.07
  • $.06
  • $.05
  • $.04
  • $.03
  • $.03
  • Processing time
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
View more price & deliveries
Total Cost: $ 0.00

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Upload time: 2024/4/29

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Product Details

Quick Details

Series: Hi-Flow® 115-AC Manufacturer: Bergquist
Usage: SIP Shape: Rectangular
Outline: 36.83mm x 21.29mm Thickness: 0.0055" (0.140mm)
Propagation Delay Time : 35 ns Material: Phase Change Compound
Adhesive: Adhesive - One Side Backing, Carrier: Fiberglass
Color: Gray Thermal Resistivity: 0.35°C/W    

Description

Shape: Rectangular
Color: Gray
Adhesive: Adhesive - One Side
Material: Phase Change Compound
Backing, Carrier: Fiberglass
Series: Hi-Flow® 115-AC
Manufacturer: Bergquist
Thickness: 0.0055" (0.140mm)
Thermal Resistivity: 0.35°C/W
Thermal Conductivity: 0.8 W/m-K
Usage: SIP
Outline: 36.83mm x 21.29mm


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