HEATPAD SIP PKG W/ADH HI-FLOW
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| Technical/Catalog Information | HF115TAAC-105 |
| Vendor | Bergquist |
| Category | Fans, Thermal Management |
| Usage | SIP |
| Shape | Rectangular |
| Material | Fiberglass |
| Thermal Conductivity | 0.8 W/m-K |
| Thermal Resistivity | 0.2°C/W |
| Thickness | 0.005" (0.127mm) |
| Outline | 36.83mm x 21.08mm |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | HF115TAAC 105 HF115TAAC105 BER170 ND BER170ND BER170 |