HMC-MDB172 Selling Leads, Price trend, HMC-MDB172 DataSheet download, circuit diagram from SeekIC.com

Features: ·Wide IF Bandwidth: DC - 5 GHz·High Image Rejection: 25 dB·High LO to RF Isolation: 35 dB·Passive: No DC Bias Required·Die Size: 2.2 x 2.0 x 0.1 mmApplication• Point-to-Point Radios• VSAT• Military Radar, ECM & EW• Test & Measurement Equipment• SATCO...

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SeekIC No. : 004364591 Detail

HMC-MDB172: Features: ·Wide IF Bandwidth: DC - 5 GHz·High Image Rejection: 25 dB·High LO to RF Isolation: 35 dB·Passive: No DC Bias Required·Die Size: 2.2 x 2.0 x 0.1 mmApplication• Point-to-Point Radios&...

HMC-MDB172 Data Sheet

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Part Number:: HMC-MDB172
Supply Ability:: 5000

Price Break

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1~5000

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Negotiable

Processing time
15 Days

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Upload time: 2024/4/27

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Product Details

Description

Features:

·Wide IF Bandwidth: DC - 5 GHz
·High Image Rejection: 25 dB
·High LO to RF Isolation: 35 dB
·Passive: No DC Bias Required
·Die Size: 2.2 x 2.0 x 0.1 mm

Application

• Point-to-Point Radios
• VSAT
• Military Radar, ECM & EW
• Test & Measurement Equipment
• SATCOM

Specifications

Storage Temperature.. -65 to 150
Operating Temperature ..-55 to 85

Description

The HMC-MDB172 is a monolithic I/Q Mixer which can be used as either an image reject mixer (IRM) or a single sideband upconverter. This passive MMIC is fabricated with GaAs Heterojunction Bipolar Transistor (HBT) Shottky diode technology. For downconversion applications, an external quadrature hybrid can be used to select the desired sideband while rejecting image signals. All bond pads and the die backside are Ti/Au metallized and the Shottky devices are fully passivated for reliable operation.

The HMC-MDB172 I/Q MMIC Mixer is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.

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HMC-MDB172

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