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Part Number: HMPS-282x
Description: These ultra-miniature products represent the blending of Agilent Technologies' proven semiconductor an...


Description: These ultra-miniature products represent the blending of Agilent Technologies' proven semiconductor an...
These ultra-miniature products represent the blending of Agilent Technologies' proven semiconductor and the latest in leadless packaging. This series of Schottky diodes is the most consistent and best all-round device available, and finds applications in mixing, detecting, switching, sampling, clamping and wave shaping at frequencies up to 6 GHz. The MiniPak package offers reduced parasitics when compared to conventional leaded diodes, and lower thermal resistance.
The HMPS-282x family of diodes offers the best all-around choice for most applications, featuring low series resistance, low forward voltage at all current levels and good RF characteristics.
Note that Agilent's manufacturing techniques assure that dice found in pairs and quads are taken from adjacent sites on the wafer, assuring the highest degree of match.
| Symbol | Parameter |
Units |
MiniPak 1412 |
| If | Forward Current (1 ms pulse) |
A |
1 |
| PIV | Peak Inverse Voltage |
V |
15 |
| Tj | Junction Temperature |
150 | |
| Tstg | Storage Temperature |
-65 to +150 | |
| jc | Thermal Resistance[2] |
/W |
150 |
These ultra-miniature products represent the blending of Agilent Technologies' proven semiconductor and the latest in leadless packaging. This series of Schottky diodes is the most consistent and best all-round device available, and finds applications in mixing, detecting, switching, sampling, clamping and wave shaping at frequencies up to 6 GHz. The MiniPak package offers reduced parasitics when compared to conventional leaded diodes, and lower thermal resistance.
The HMPS-282x family of diodes offers the best all-around choice for most applications, featuring low series resistance, low forward voltage at all current levels and good RF characteristics.
Note that Agilent's manufacturing techniques assure that dice found in pairs and quads are taken from adjacent sites on the wafer, assuring the highest degree of match.
HMP8112
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