HSM2692

Features: · Low forward resistance. (rf = 0.9 max)· Low capacitance. (C = 1.2pFmax)· MPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol Value Unit Reverse voltage VR 35 V Power dissipation PD 150 ...

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HSM2692 Picture
SeekIC No. : 004366151 Detail

HSM2692: Features: · Low forward resistance. (rf = 0.9 max)· Low capacitance. (C = 1.2pFmax)· MPAK package is suitable for high density surface mounting and high speed assembly.PinoutSpecifications It...

floor Price/Ceiling Price

Part Number:
HSM2692
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/25

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Product Details

Description



Features:

· Low forward resistance. (rf = 0.9 max)
· Low capacitance. (C = 1.2pFmax)
· MPAK package is suitable for high density surface mounting and high speed assembly.





Pinout

  Connection Diagram






Specifications

Item
Symbol
Value
Unit
Reverse voltage
VR
35
V
Power dissipation
PD
150
mW
Junction temperature
Tj
125
Storage temperature
Tstg
45 to +125
Operation temperature
Topr
20 to +60





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