HSU276

Features: · High forward current, Low capacitance.· Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol Value Unit Reverse voltage VR 3 V Average rectified current IO 30 mA ...

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HSU276 Picture
SeekIC No. : 004366501 Detail

HSU276: Features: · High forward current, Low capacitance.· Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol ...

floor Price/Ceiling Price

Part Number:
HSU276
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/26

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Product Details

Description



Features:

·  High forward current, Low capacitance.
·  Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly.



Pinout

  Connection Diagram


Specifications

Item
Symbol
Value
Unit
Reverse voltage
VR
3
V
Average rectified current
IO
30
mA
Storage temperature
Tj
125
Operation temperature
Tstg
55 to 125



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