Features: · High forward current, Low capacitance.· Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol Value Unit Reverse voltage VR 3 V Average rectified current IO 30 mA ...
HSU276: Features: · High forward current, Low capacitance.· Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol ...
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Item |
Symbol |
Value |
Unit |
Reverse voltage |
VR |
3 |
V |
Average rectified current |
IO |
30 |
mA |
Storage temperature |
Tj |
125 |
|
Operation temperature |
Tstg |
55 to 125 |