HSU227

Features: · Low capacitance. (C=3.0pF max)· Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol Value Unit Repetitive peak reversevoltage VRRM 25 V Average rectified current IO ...

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HSU227 Picture
SeekIC No. : 004366499 Detail

HSU227: Features: · Low capacitance. (C=3.0pF max)· Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly.PinoutSpecifications Item Symbol Value ...

floor Price/Ceiling Price

Part Number:
HSU227
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/26

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Product Details

Description



Features:

·  Low capacitance. (C=3.0pF max)
·  Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed assembly.



Pinout

  Connection Diagram


Specifications

Item
Symbol
Value
Unit
Repetitive peak reverse
voltage
VRRM
25
V
Average rectified current
IO
50
mA
Non-Repetitive peak
forward surge current
IFSM*2
200
mA
Storage temperature
Tj
125
Operation temperature
Tstg
55 to 125
Note: 1. 10msec sine wave 1 pulse


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