Features: • 7.5A, 30V - rDS(ON) = 0.026Ω, VGS = 10V - rDS(ON) = 0.033Ω, VGS = 5V• PWM Optimized for Synchronous Buck Applications• Fast Switching• Low Gate Charge - Qg Total 15nC (Typ)• Low Capacitance - CISS 725pF (Typ) - CRSS 36pF (Typ)Specifications ...
HUF76112SK8: Features: • 7.5A, 30V - rDS(ON) = 0.026Ω, VGS = 10V - rDS(ON) = 0.033Ω, VGS = 5V• PWM Optimized for Synchronous Buck Applications• Fast Switching• Low Gate Charge...
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| SYMBOL | PARAMETER | HUF76112SK8 | UNITS |
| VDSS | Drain to Source Voltage (Note 1) | 30 | V |
| VDGR | Drain to Gate Voltage (RGS = 20kΩ) (Note 1) | 30 | V |
| VGS | Gate to Source Voltage | ±16 | V |
| ID ID IDM |
Drain Current Continuous (TA = 25, VGS = 10V) (Figure 2) (Note 2) Continuous (TA = 100, VGS = 5V) (Note 2) Pulsed Drain Current |
7.5 4.0 Figure 4 |
A A A |
| PD | Power Dissipation (Note 2) Derate Above 25oC |
2.5 20 |
W mW/oC |
| TJ, TSTG | Operating and Storage Temperature | -55 to 150 | |
| TL Tpkg |
Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s Package Body for 10s, See Techbrief TB334 |
300 260 |
|
| THERMAL SPECIFICATIONS Thermal Resistance Junction to Ambient | |||
| RJA | Measured using FR-4 board with 0.76 in2 (490.3 mm2) copper pad at 10 second. |
50 | /W |
| Measured using FR-4 board with 0.054 in2 (34.8 mm2) copper pad at 1000 seconds. (Figure 23) |
152 | /W | |
| Measured using FR-4 board with 0.0115 in2 (7.42 mm2) copper pad at 1000 seconds. (Figure 23) |
189 | /W | |