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MFG:INTERSIL  Package Cooled:DIP/SOP  D/C:08+  

HUF76419P3 Product Image

HUF Series Datasheet download

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Part Number: HUF76419P3

 

MFG: INTERSIL

Package Cooled: DIP/SOP

D/C: 08+

 

Urgent Purchase

HUF76419P3 Maximum Ratings

Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . VDSS 60 V
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) .. . . . . . . . . . . . VDGR 60 V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . VGS ±16 V
Drain Current    
Continuous (TC = 25, VGS = 5V). . . . .. . . . . ID 27 A
Continuous (TC = 25, VGS = 10V) (Figure 2) . . . . . . . . . . . . ID 29 A
Continuous (TC= 100, VGS = 5V) . . . . . . . . . . . . . . . ID 19 A
Continuous (TC= 100, VGS = 4.5V) (Figure 2) . . . . . . . . . . . ID 18 A
Pulsed Drain Current . . . . . . . . . . . . . . . . . IDM Figure 4  
Pulsed Avalanche Rating . . . . . . . . . . . . . . . UIS Figures 6, 17, 18  
Power Dissipation . . . . . . .. . . . . . PD
 75 W
Derate Above . . . . . . . . . . . . .25 0.5 W/
Operating and Storage Temperature . . . . . TJ, TSTG -55 to 175
Maximum Temperature for Soldering    
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . TL 300
Package Body for 10s, See Techbrief TB334. . . . . . . . Tpkg 260

HUF76419P3 Features

• Ultra Low On-Resistance
           - rDS(ON) = 0.035Ω, VGS = 10V
           - rDS(ON) = 0.040Ω, VGS = 5V
• Simulation Models
           - Temperature Compensated PSPICE® and SABER© Electrical Models
           - Spice and SABER© Thermal Impedance Models
           - www.Intersil.com
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• Switching Time vs RGS Curves

HUF76419P3 datasheet

HUF76419P3
PDF/DataSheet Download

  • Datasheet: HUF76419P3
  • File Size: 342434 KB
  • Manufacturer: INTERSIL [Intersil Corporation]
  • Click here to Download

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