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MFG:FAIRCHILD Package Cooled:DIP/SOP D/C:08+

MFG:FAIRCHILD Package Cooled:DIP/SOP D/C:08+

| Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . VDSS | 60 | V |
| Drain to Gate Voltage (RGS = 20kΩ) (Note 1) .. . . . . . . . . . . . VDGR | 60 | V |
| Gate to Source Voltage . . . . . . . . . . . . . . . . . . . VGS | ±16 | V |
| Drain Current | ||
| Continuous (TC = 25, VGS = 5V). . . . .. . . . . ID | 55 | A |
| Continuous (TC = 25, VGS = 10V) (Figure 2) . . . . . . . . . . . . ID | 59 | A |
| Continuous (TC= 100, VGS = 5V) . . . . . . . . . . . . . . . ID | 39 | A |
| Continuous (TC= 100, VGS = 4.5V) (Figure 2) . . . . . . . . . . . ID | 37 | A |
| Pulsed Drain Current . . . . . . . . . . . . . . . . . IDM | Figure 4 | |
| Pulsed Avalanche Rating . . . . . . . . . . . . . . . UIS | Figures 6, 17, 18 | |
| Power Dissipation . . . . . . .. . . . . . PD |
130 | W |
| Derate Above . . . . . . . . . . . . .25 | 0.87 | W/ |
| Operating and Storage Temperature . . . . . TJ, TSTG | -55 to 175 | |
| Maximum Temperature for Soldering | ||
| Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . TL | 300 | |
| Package Body for 10s, See Techbrief TB334. . . . . . . . Tpkg | 260 |
HUF76432S3S
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