HY27UG08

Features: HIGH DENSITY NAND FLASH MEMORIES - Cost effective solutions for mass storage applicationsNAND INTERFACE - x8 bus width. - Multiplexed Address/ Data - Pinout compatibility for all densitiesSUPPLY VOLTAGE - 3.3V device: VCC = 2.7 to 3.6V : HY27UG(08/16)4G(2/D)MMemory Cell Array = (2K + 64)...

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SeekIC No. : 004368166 Detail

HY27UG08: Features: HIGH DENSITY NAND FLASH MEMORIES - Cost effective solutions for mass storage applicationsNAND INTERFACE - x8 bus width. - Multiplexed Address/ Data - Pinout compatibility for all densities...

floor Price/Ceiling Price

Part Number:
HY27UG08
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/5/3

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Product Details

Description



Features:

HIGH DENSITY NAND FLASH MEMORIES
    - Cost effective solutions for mass storage applications
NAND INTERFACE
    - x8 bus width.
    - Multiplexed Address/ Data
    - Pinout compatibility for all densities
SUPPLY VOLTAGE
    - 3.3V device: VCC
        = 2.7 to 3.6V : HY27UG(08/16)4G(2/D)M
Memory Cell Array
     = (2K + 64) Bytes x 64 Pages x 4,096 Blocks
     = (1K + 32) Words x 64 Pages x 4,096 Blocks
PAGE SIZE
    - x8 device : (2K + 64 spare) Bytes
                      : HY27UG084G(2/D)M
    - x16 device : (1K + 32 spare) Words
                        : HY27UG164G2M
BLOCK SIZE
    - x8 device: (128K + 4K spare) Bytes
    - x16 device: (64K + 2K spare) Words
PAGE READ / PROGRAM
    - Random access: 30us (max.)
    - Sequential access: 50ns (min.)
    - Page program time: 200us (typ.)
COPY BACK PROGRAM MODE
    - Fast page copy without external buffering
CACHE PROGRAM MODE
    - Internal Cache Register to improve the program throughput
FAST BLOCK ERASE
    - Block erase time: 2ms (Typ.)
STATUS REGISTER
ELECTRONIC SIGNATURE
    - Manufacturer Code
    - Device Code
CHIP ENABLE DON'T CARE OPTION
    - Simple interface with microcontroller
AUTOMATIC PAGE 0 READ AT POWER-UP OPTION
    - Boot from NAND support
    - Automatic Memory Download
SERIAL NUMBER OPTION
HARDWARE DATA PROTECTION
    - Program/Erase locked during Power transitions
DATA INTEGRITY
    - 100,000 Program/Erase cycles
    - 10 years Data Retention
PACKAGE
    - HY27UG(08/16)4G2M-T(P)
                 : 48-Pin TSOP1 (12 x 20 x 1.2 mm)
                 - HY27UG(08/16)4G2M-T (Lead)
                 - HY27UG(08/16)4G2M-TP (Lead Free)
    - HY27UG(08/16)4GDM-UP
                : 52-ULGA (12 x 17 x 0.65 mm)
                - HY27UG(08/16)4GDM-UP (Lead Free)



Pinout

  Connection Diagram


Specifications

Symbol Parameter Value Unit
3.3V
TA Ambient Operating Temperature (Commercial Temperature Range) 0 to 70
Ambient Operating Temperature (Extended Temperature Range) -25 to 85
Ambient Operating Temperature (Industrial Temperature Range) -40 to 85
TBIAS Temperature Under Bias -50 to 125
TSTG Storage Temperature -65 to 150
VIO(2) Input or Output Voltage -0.6 to 4.6 V
Vcc Supply Voltage -0.6 to 4.6 V



Description

The HYNIX HY27UG08 series is a 512Mx8bit with spare 16Mx8 bit capacity. The device is offered in 3.3V Vcc Power Supply.

HY27UG08's NAND cell provides the most cost-effective solution for the solid state mass storage market.

The memory HY27UG08 is divided into blocks that can be erased independently so it is possible to preserve valid data while old data is erased.

The device HY27UG08 contains 4096 blocks, composed by 64 pages consisting in two NAND structures of 32 series connected Flash cells.

A program operation allows to write the 2112-byte page in typical 200us and an erase operation can be performed in typical 2ms on a 128K-byte(X8 device) block.

Data in the page mode can be read out at 50ns cycle time per byte. The I/O pins serve as the ports for address and data input/output as well as command input. This HY27UG08 interface allows a reduced pin count and easy migration towards different densities, without any rearrangement of footprint.

Commands, Data and Addresses are synchronously introduced using CE#, WE#, ALE and CLE input pin. The HY27UG08 on-chip Program/Erase Controller automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data.

The modifying can be locked using the WP# input pin.

The output pin RB# (open drain buffer) signals the status of the device during each operation. In a system with multiple memories the RB# pins can be connected all together to provide a global status signal.

Even the write-intensive systems can take advantage of the HY27UG08 extended reliability of 100K program/ erase cycles by providing ECC (Error Correcting Code) with real time mapping-out algorithm.

Optionally the chip HY27UG08 could be offered with the CE# don't care function. This option allows the direct download of the code from the NAND Flash memory device by a microcontroller, since the CE# transitions do not stop the read operation. The copy back function allows the optimization of defective blocks management: when a page program operation fails the data can be directly programmed in another page inside the same array section without the time consuming serial data insertion phase.

The cache program feature allows the data insertion in the cache register while the data register is copied into the flash array. This pipelined program operation improves the program throughput when long files are written inside the memory HY27UG08.

A cache read feature is also implemented. This HY27UG08 feature allows to dramatically improve the read throughput when consecutive pages have to be streamed out.

This device HY27UG08 includes also extra features like OTP/Unique ID area, Block Lock mechanism, Automatic Read at Power Up, Read ID2 extension.

The HYNIX HY27UG08 series is available in 48 - TSOP1 12 x 20 mm, 52-ULGA 12 x 17 mm.




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