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MFG:HY


Part Number: HY57V64820HGTP
MFG: HY
Description: The Hynix HY57V64820HG is a 67,108,864-bit CMOS Synchronous DRAM, ideally suited for the main memoryapplications whi...
MFG:HY


MFG: HY
Description: The Hynix HY57V64820HG is a 67,108,864-bit CMOS Synchronous DRAM, ideally suited for the main memoryapplications whi...
The Hynix HY57V64820HG is a 67,108,864-bit CMOS Synchronous DRAM, ideally suited for the main memoryapplications which require large memory density and high bandwidth. HY57V64820HG is organized as 4banks of 2,097,152x8.
HY57V64820HG is offering fully synchronous operation referenced to a positive edge of the clock. All inputsand outputs are synchro-nized with the rising edge of the clock input. The data paths are internallypipelined to achieve very high bandwidth. All input and outputvoltage levels are compatible with LVTTL.
Programmable options include the length of pipeline (Read latency of 2 or 3), the number of consecutive reador write cycles initiated bya single control command (Burst length of 1,2,4,8 or Full page), and theburst count sequence(sequential or interleave). A burst of reador write cycles in progress can be terminated by aburst terminate command or can be interrupted and replaced by a new burst read orwrite command on any cycle. (This pipelined design is not restricted by a `2N` rule.)
| Parameter |
Symbol |
Rating |
Unit |
| Ambient Temperature |
TA |
0 ~ 70 |
|
| Storage Temperature |
TSTG |
-55 ~ 125 |
|
| Voltage on Any Pin relative to VSS |
VIN, VOUT |
-1.0 ~ 4.6 |
V |
| Voltage on VDD relative to VSS |
VDD, VDDQ |
-1.0 ~ 4.6 |
V |
| Short Circuit Output Current |
IOS |
50 |
mA |
| Power Dissipation |
PD |
1 |
W |
| Soldering Temperature .Time |
TSOLDER |
260 .10 |
°C .Sec |
HY57V64820HGTP
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