IL217A

Features: • High Current Transfer Ratio, IF=1 mA•IL215A-20% Minimum•IL216A-50% Minimum•IL217A-100% Minimum• Isolation Voltage, 2500 VAC RMS• Electrical Specifications Similar to Standard 6 Pin Coupler• Industry Standard SOIC-8 Surface Mountable PackageR...

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IL217A Picture
SeekIC No. : 004373926 Detail

IL217A: Features: • High Current Transfer Ratio, IF=1 mA•IL215A-20% Minimum•IL216A-50% Minimum•IL217A-100% Minimum• Isolation Voltage, 2500 VAC RMS• Electrical Specificat...

floor Price/Ceiling Price

Part Number:
IL217A
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/5/2

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Product Details

Description



Features:

• High Current Transfer Ratio, IF=1 mA
IL215A-20% Minimum
IL216A-50% Minimum
IL217A-100% Minimum
• Isolation Voltage, 2500 VAC RMS
• Electrical Specifications Similar to Standard 6 Pin Coupler
• Industry Standard SOIC-8 Surface Mountable Package
• Standard Lead Spacing, .05"
• Available in Tape and Reel Option (Conforms to EIA Standard RS481A)
• Compatible with Dual Wave, Vapor Phase and IR Reflow Soldering
• Underwriters Lab File #E52744 (Code Letter P)



Specifications

Peak Reverse Voltage ............................6.0 V
Continuous Forward Current ................60 mA
Power Dissipation at 25°C..................90 mW
Derate Linearly from 25°C..........1.2 mW/°C



Description

The IL217A are optically coupled pairs with a Gallium Arsenide infrared LED and a silicon NPN phototransistor. Signal information, including a DC level, can be transmitted by the device while maintaining a high degree of electrical isolation between input and output. The IL215A//216A/217A comes in a standard SOIC-8 small outline package for surface mounting which makes it ideally suited for high density applications with limited space. In addition to eliminating through-holes requirements, this package conforms to standards for surface mounted devices.

The high CTR at low input current of the IL217A is designed for low power consumption requirements such as CMOS microprocessor interfaces.




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