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MFG:IR Package Cooled:DIP-8


Part Number: IR2117
MFG: IR
Package Cooled: DIP-8
Description: The IR2117 is a high voltage, high speed power MOSFET and IGBT driver. Proprietary HVIC and latch immu...
MFG:IR Package Cooled:DIP-8


MFG: IR
Package Cooled: DIP-8
Description: The IR2117 is a high voltage, high speed power MOSFET and IGBT driver. Proprietary HVIC and latch immu...
The IR2117 is a high voltage, high speed power MOSFET and IGBT driver. Proprietary HVIC and latch immune CMOS technologies enable ruggedized monolithic construction. The logic input is compatible with standard CMOS outputs. The output driver features a high pulse current buffer stage designed for minimum cross-conduction. The floating channel can be used to drive an N-channel power MOSFET or IGBT in the high or low side configuration which operates up to 600 volts.
| Parameter | Value | Units | |||
| Symbol | Definition | Min. | Max. | ||
| VB | High Side Floating Supply Voltage | -0.3 | 625 | V | |
| VS | High Side Floating Supply Offset Voltage | VB - 25 | VB + 0.3 | ||
| VHO | High Side Floating Output Voltage | VS - 0.3 | VB + 0.3 | ||
| VCC | Logic Supply Voltage | -0.3 | 25 | ||
| VIN | Logic Input Voltage | -0.3 | VCC + 0.3 | ||
| dVs/dt | Allowable Offset Supply Voltage Transient (Figure 2) | - | 50 | V/ns | |
| PD | Package Power Dissipation @ TA +25 | (8 Lead DIP) | - | 1.0 | V/ns |
| (8 Lead SOIC) | - | 0.625 | |||
| RJA | Thermal Resistance, Junction to Ambient | (8 Lead DIP) | - | 125 | /W |
| (8 Lead SOIC) | - | 200 | |||
| TJ | Junction Temperature | - | 150 | ||
| TS |
Storage Temperature | -55 | 150 | ||
| TL | Lead Temperature (Soldering, 10 seconds) | - | 300 | ||
IR2117
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