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MFG:IR  Package Cooled:TO-262  D/C:5000  

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Part Number: IRF1010EL

 

MFG: IR

Package Cooled: TO-262

D/C: 5000

Description: Advanced HEXFET Power MOSFETs from International Rectifier utilize advanced processing technique...


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IRF1010EL General Description


Advanced HEXFET  Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on- resistance in any existing surface mount package. TheD2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.

The through-hole version (IRF1010EL) is available for low- profile applications.

IRF1010EL Maximum Ratings

  Parameter Max. Units
ID @ TC =25 Continuous Drain Current,VGS @ 10V 84 A
ID @ TC =100 Continuous Drain Current,VGS @ 10V 59
IDM Pulsed Drain Current 330
PD @ TC =25 Power Dissipation 200 W
  Linear Derating Factor 1.4 W/
VGS Gate-to-Source Voltage ±20 V
IAR Avalanche Current 50 A
EAR Repetitive Avalanche Energy 17 mJ
dv/dt Peak Diode Recovery dv/dt 4.0 V/ns
TJ
TSTG
Operating Junction and
Storage Temperature Range
-55 to + 175
  Soldering Temperature, for 10 seconds 300 (1.6mm from case)
  Mounting Torque, 6-32 or M3 screw 10 lbf.in (1.1 N.m)  

IRF1010EL Features

`Advanced Process Technology
`Surface Mount (IRF1010ES)
`Low-profile through-hole (IRF1010EL
`175 Operating Temperature
`Fast Switching
`Fully Avalanche Rated

IRF1010EL datasheet

IRF1010EL
PDF/DataSheet Download

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