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MFG:IR  Package Cooled:D2-Pak  D/C:09+  

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Part Number: IRF540ZS

 

MFG: IR

Package Cooled: D2-Pak

D/C: 09+

Description: Specifically designed for Automotive applications, ID = 36A this HEXFET® Power MOSFET u...


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IRF540ZS General Description


Specifically designed for Automotive applications, ID = 36A this HEXFET® Power MOSFET utilizes the latest processing techniques to achieve extremely low onresistance per silicon area. Additional features of this design are a 175°C junction operating temperature, fast switching speed and improved repetitive avalanche rating . These features combine to make this design an extremely efficient and reliable device for use in Automotive applications and a wide variety of other applications.

IRF540ZS Maximum Ratings

 
Parameter
Max.
Units
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Silicon Limited)
36
A
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V
25
IDM Pulsed Drain Current
140
PD @TC = 25°C Power Dissipation
92
W
  Linear Derating Factor
0.61
W/°C
VGS Gate-to-Source Voltage
± 20
V
EAS (Thermally limited) Single Pulse Avalanche Energy
83
mJ
EAS (Tested ) Single Pulse Avalanche Energy Tested Value
120
IAR Avalanche Current 
See Fig.12a, 12b, 15, 16
A
EAR Repetitive Avalanche Energy
mJ

TJ
TSTG

Operating Junction and
Storage Temperature Range
-55 to + 175
°C
  Soldering Temperature, for 10 seconds
300 (1.6mm from case )
  Mounting torque, 6-32 or M3 srew
10 lbf`in (1.1N`m)

IRF540ZS Features

Advanced Process Technology
Ultra Low On-Resistance
175°C Operating Temperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax

IRF540ZS datasheet

IRF540ZS
PDF/DataSheet Download

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