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MFG:IOR  Package Cooled:SMD-8  

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IRF Series Datasheet download

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Part Number: IRF7317

 

MFG: IOR

Package Cooled: SMD-8

 

Description: Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achiev...


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IRF7317 General Description


Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dramatically reduced board space. The package is designed for vapor phase, infra red, or wave soldering techniques.

IRF7317 Maximum Ratings

 
Symbol
Maximum
N-Channel PChannel
Units
Drain-Source Voltage
VDS
20
-20
V
Gate-Source Voltage
VGS
± 12
± 12
V
Continuous Drain Current… TA = 25°C
ID
6.6
-5.3
A
  TA = 70°C
ID
5.3
-4.3
A
Pulsed Drain Current
IDM
26
-21
A
Continuous Source Current (Diode Conduction)
IS
2.5
-2.5
A
Maximum Power Dissipation TA = 25°C
PD
2.0
2.0
W
  TA = 70°C
PD
1.3
1.3
W
Single Pulse Avalanche Energy
EAS
100
150
mJ
Avalanche Current
IAR
4.1
-2.9
A
Repetitive Avalanche Energy
EAR
0.20
0.20
mJ
Peak Diode Recovery dv/dt
dv/dt
5.0
-5.0
V/ ns
Junction and Storage Temperature Range
TJ, TSTG
-55 to + 150
°C

IRF7317 Features

· Generation V Technology
·Ultra Low On-Resistance
·Dual N and P Channel MOSFET
· Surface Mount
·Fully Avalanche Rated

IRF7317 datasheet

IRF7317
PDF/DataSheet Download

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